Sigmetrix Announces Sponsorship of 2017 3D Collaboration & Interoperability Congress + Quality Information Framework Summit

Global experts in GD&T and Mechanical Variation to Sponsor Conference focused on Model-Based Definition (MBD) and Model-Based Enterprise (MBE)

MCKINNEY, Texas  – September 7, 2017 – Sigmetrix announced today that it will be a sponsor of  3D Collaboration & Interoperability Congress + Quality Information Framework Summit. The conference will be held October 3-5, 2017 in Golden, Colorado. The Sigmetrix team will be demonstrating their software during the 3D CIC + QIF Summit at the  American Mountaineering Center.



The 3D Collaboration & Interoperability Congress focuses on CAD collaboration and interoperability for the entire product lifecycle. With an increased need for information to be digital and fully associated for Model-Based Definition (MBD), Model-Based Enterprise (MBE), and Smart Manufacturing, this year’s event is focused on engineering and shop floor collaboration. Sigmetrix offers an array of software and training solutions to facilitate the shift to an MBD environment. These solutions include:

•  CETOL 6σ, a fully-integrated 3D tolerance analysis solution

•  GD&T Advisor, an interactive tool that provides expert guidance on the correct application of GD&T

•  EZtol, a stand alone 1-D tolerance stackup analysis tool

•  Training on a variety of topics including GD&T, tolerance analysis, dimensional management and MBD / MBE

•  Consulting and implementation services to solve today’s most challenging assembly engineering problems

“3D CIC addresses real-world challenges and solutions throughout all stages of the product lifecycle using 3D models,” said Chris Wilkes, President & CEO of Sigmetrix. “Sigmetrix’s leading-edge solutions allow design teams to define the requirements with GD&T annotations completely within the CAD environment, and perform their analyses in real-time. This allows products to get to market faster with lower development, support, and maintenance costs throughout its lifecycle.” 

New this year is the inclusion of the Quality Information Framework (QIF) Summit with 3D CIC, through a partnership with the Dimensional Metrology Standards Consortium (DMSC). CAD user group meetings for NX, SOLIDWORKS, PTC Creo, and Inventor will frame the 3D CIC event to round off the week dedicated to Model-Based Definition (MBD) and Model-Based Enterprise (MBE).

“3D CIC has a broad appeal for mechanical and systems engineers in a variety of product development industries, including aerospace, defense, and medical.” stated Jennifer Herron, CEO of Action Engineering. “Every day at  Action Engineering we are studying new methods to reduce product time to market through the use of MBD. We are happy to have Sigmetrix as an event sponsor of 3D CIC again this year because Sigmetrix’s CETOL 6σ and GD&T Advisor technologies enable companies to leverage semantic (digitally associated) tolerances. The advent of smart manufacturing begins with smart CAD models, so the opportunity that Sigmetrix products offer to organizations have the potential to be a major game changer in reducing costs over a product’s life. 

For more information on the 2017 3D Collaboration & Interoperability Congress + Quality Information Framework Summit visit:   http://go.pardot.com/e/146541/2017-09-07/k8h76/46416867

LEARN MORE ABOUT SIGMETRIX SOFTWARE SOLUTIONS

About Sigmetrix

Sigmetrix is a global provider of comprehensive, easy-to-use software solutions that help users achieve robust designs through tolerance analysis and the correct application of GD&T. With over 20 years of research and development, Sigmetrix products eliminate the error between as-designed assemblies and as-produced products. For more information, visit their website at  www.sigmetrix.com

About 3D CIC

3D CIC returns to Golden, Colorado for the 2017 event, with the theme: UNITE: Engineering & Shop Floor Collaboration. Real users share their experiences for all stages of the product lifecycle, with the focus on real-world challenges and solutions for turning design concepts into manufacturing product reality using 3D models. The joint 3D CIC and QIF Symposium event will be held  October 3-5, 2017, with the American Mountaineering Center serving as host venue for the joint event. For more information and to register, visit:  http://go.pardot.com/e/146541/2017-09-07/k8h76/46416867.




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