According to TechNavio, 3D NAND is expected to grow at a compounded annual growth rate of over 180% by 2018. The increase in memory requirements and demand for low form factors for NAND flash is contributing to this growth.
"The explosion of data created by the rapid growth of the Internet of Things and more advanced automotive systems is placing greater demands on storage technologies. 3D NAND will revolutionize how data will be more efficiently stored in the future," said Ali Pourkeramati, senior vice president of strategic alliances at Spansion. "Our leading charge trap MirrorBit® technology, which we invented over 10 years ago, will be the key advantage for 3D NAND innovation and will provide unparalleled high-performance data storage."
"We are pleased to co-develop 3D NAND technology with Spansion," said Michael Chen, Chief Business Officer of XMC. "XMC will continue to leverage its leading edge manufacturing capabilities, extensive volume production experience with charge trap technology and world-class R&D team in memory expertise. By partnering with Spansion, we are confident to successfully bring innovative 3D NAND technology to market. "
The first 3D NAND products will be available in 2017.
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Spansion (NYSE: CODE) is a global leader in embedded systems solutions. Spansion's flash memory, microcontrollers, analog and mixed-signal products drive the development of faster, intelligent, secure and energy efficient electronics. Spansion is at the heart of electronics systems, connecting, controlling, storing and powering everything from automotive electronics and industrial systems to the highly interactive and immersive consumer devices that are enriching people's daily lives. For more information, visit http:// www.spansion.com
XMC is an emerging leader in semiconductor manufacturing, with a unique partnership model and a specialized technology focus. The company offers comprehensive 300MM foundry services built on proven technology expertise and a commitment to customer service excellence. It first began production in 2008 and is headquartered in Wuhan, China. More information can be found at www.xmcwh.com
Spansion®, the Spansion logo, MirrorBit®, HyperBus, HyperFlash, HyperRAM and combinations thereof, are trademarks or registered trademarks of Spansion LLC in the United States and other countries. Other names used are for informational purposes only and may be trademarks of their respective owners.
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SOURCE Spansion Inc.
Spansion Press: Michele Landry, 408-616-3817
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