Collaboration & Interoperability Congress - 2011 Update
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Collaboration & Interoperability Congress - 2011 Update

2011 Collaboration and Interoperabillity Congress


Study after study has shown that improving collaboration and communication will enhance
many aspects of innovation and business performance. Yet, these functions are often overlooked because they are complex and difficult to address.

Now in its eighth year, the 3D Collaboration & Interoperability Congress (CIC) is the only vendor-neutral event in the world addressing collaboration and interoperability in manufacturing and business communications. The two-and-a-half day international event gives attendees a unique opportunity to interact, learn and share experiences with many of the thought leaders from a wide variety of discrete manufacturing industries, such as automotive, aerospace, heavy equipment, and electronics, along with representatives from government and defense communities (e.g. from logistics and maintenance).

The 2011 CIC will be held May 23-25 in Denver, Colorado at the Inverness Hotel and Conference Center. Registration is now open and encouraged for those dedicated to fostering and enhancing collaboration and interoperability in manufacturing. Visit the web site, www.3DCIC.com, to register or to learn more about the event. All presentations and audios from the 2010, 2009, and 2008 events are also available for free at the web site.

The CIC event has rapidly grown into an essential forum for executives, managers, senior engineers, and IT vendors. The dialogue at CIC has become a yearly barometer of the state of collaboration and interoperability, which have such a huge impact on PLM success and overall productivity across all sectors of manufacturing.

Visit www.3dcic.com to register now at time-limited early discounted rates.