|February 2009 Issue|
View from the Back of the Room
Looking Back, Looking Ahead
Another DesignCon is now behind us. Like a lot of things these days, the weeks leading up to the event were filled with uncertainty. Sure, the pre-registration numbers looked good—best ever, in fact—but would the people actually show up? Would the program meet everyone’s expectations? Would questions about how the electronics industry is faring in the current economic climate overshadow everything?
To those who attended DesignCon 2009, the answers were obvious. Whatever the climate might have been outside the Santa Clara Convention Center, inside it was buzzing with the latest on electronic design tools and technology.
Sponsored White Paper
A Simple Via ExperimentAs presented at DesignCon 2009
Vias play a critical role in the high frequency electrical behavior of packages and printed circuit boards. Although measured data and electromagnetic solvers can be used to study via electrical properties, a clearer description of the underlying physics would make engineering judgment concerning vias more effective.
This paper introduces a simple experiment and corresponding textbook solution for radial TEM waves which demonstrates the physics of vias. Extensions of this experiment show how the underlying physical model can be used to explain the behavior of differential vias, ground vias, and via antipads.
DesignCon 2009 Video Interviews
Brought to you by DesignCon 2009 Media Sponsor, PCB Design 007…
News Coverage from DesignCon 2009
Serdes about to get extreme makeover
Analysis: Plug-and-play IP goal remains elusive
Three enablers to drive IC innovation
High speed systems defy test, tools
DesignCon Exhibitor PodcastsHear about some of the exciting products and technologies featured on the DesignCon 2009
Secure your exhibit space for 2010!
DesignCon 2010 exhibit space is now available! Featuring the new PCB Summit and IP Summit, DesignCon is the premier annual Silicon Valley event for the electronic design and semiconductor industries.
DesignCon 2009 Keynote Addresses
DesignVision Award Winners
ANNOUNCEMENT! Don't miss the first-ever DesignVision Awards Gala next year!
The IEC will honor the achievements of the most innovative semiconductor companies, the most prominent visionaries, and the most successful design tools.
Announcing the WINNER of the 2009 Chiphead Video Contest
And the winner is…NEC with their video production: SHOWDOWN at DesignCon Corral
A special thanks to all those that participated in our first-ever YouTube Chiphead Video Contest!
Join my Social Networks and continue the conversations started at DesignCon 2009 throughout the year!
Chiphead’s 2009 Photo Gallery