Mentor Graphics Mechanical Analysis Thermal e-News September 2008

Simclar use Thermal Simulation to Help Design New Telecom Platform That Delivers 40Gbps Bandwidth

Simclar Group used FloTHERM thermal simulation software to develop a new platform that goes well beyond the Advanced Telecom Computing Architecture (ATCA) 3.0 specification. “Simulation gave me the freedom to consider a wide range of alternative designs by letting me evaluate their performance quickly and at very little cost,” said Dave Watson, Thermal Design Team Leader for Simclar Group. “We succeeded in developing a platform that goes well beyond the ATCA 3.0 specification by delivering 40 Gbps backplane bandwidth and 50 CFM airflow per slot with near-perfect airflow distribution.”

“Thermal simulation was a critical process in our product development,” Watson said. “Thermal simulation is like having X-ray vision. It lets you see inside the box to look at airflow, pressures and temperatures at any point. A single thermal simulation gives you a detailed understanding of what is going on inside the box and helps you quickly identify the root causes of the problem.”



Thermally Efficient Technique for High-Power LED Packages

Nikkei Electronics Asia -- July 2008

High power, high brightness light emitting diodes (LED) are penetrating into a number of lighting  applications due to their excellent color saturation and long life characteristics. However, the ability to prevent LEDs from overheating is the most challenging task for thermal designers. Therefore, the computational fluid dynamic (CFD) modeling of LED components becomes increasingly important in the application design process. This article compares the results of an experiment using a high power LED package on a star metal core printed circuit board (MCPCB) with and without a heat sink. Following the comparison discussion, a thermal modeling technique for LED packaging with the use of a heat sink will be highlighted. The results of CFD modeling are promising, and illustrate that this technique can be used for LED system level evaluation. This article also discusses the effects of using thermal interface materials in an LED package.


Thermal Simulation Reduces Cost of Stacked Module Potting Compound 50%

C-MAC MicroTechnology used FloTHERM thermal simulation software to determine that the thermal requirements of a stacked module could be met with a potting compound that cost only half the amount of the default choice. “Our engineer simulated the junction temperatures of the devices in the stacked modules while using three different potting compounds,” said Bob Hunt, Head of Engineering for C-MAC. “Simulation was much faster and less expensive than the alternative of building and testing prototypes.”




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Training Events

September
17 IC Package Modeling Training:
Chicago, US
 
17 FloEFDPro Seminar:
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17 FloEFDPro Seminar:
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17 FloTHERM Web Seminar:
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18 T3Ster Training:
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18 FloTHERM Web Seminar:
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22-23 Thermal Management Program:
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23-24 FloEFDV5 Training:
Orsay, France
 
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24 User Conference:
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24-26 FloTHERM Training:
Milano, Italy
 
29 FloTHERM Web Seminar:
Online, Germany
 



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