ITI TranscenData Licenses HOOPS? Technology from Tech Soft for Next CADIQ? Release

Geometry and Topology Visualization capabilities enhanced through use of
HOOPS 3D Component Technology


Oakland, CA and Milford, OH – April 15, 2003 – Tech Soft America (TSA), the
leading provider of component graphics technology to the CAD/CAM/CAE
industry, and ITI TranscenData, the product data interoperability business
of International TechneGroup Incorporated (ITI), announce that the next
generation of CADIQ will be built on the HOOPS 3D Application Framework
(HOOPS 3d/AF) as well as support export of the OpenHSF format, a budding
standard for engineering visualization.

CADIQ, the industry’s leading CAD model quality assurance tool, enables
users to analyze, identify, and highlight hidden geometry/topology errors
along with shape and fit changes within the model. In this way potential
problems can be corrected before the model reaches downstream product
development applications such as analysis, simulation, rapid prototyping, NC
manufacturing and data exchange.

“With HOOPS/3dAF, the base application infrastructure is already designed
and built,” said Don Hemmelgarn, President of ITI TranscenData. “This
allows us to take advantage of the power of the underlying set of component
and focus CADIQ development on true added value rather than re-invent the
graphics power and functionality encapsulated within the HOOPS product set.”

“Given ITI Transcendata's position as a leading provider of data
interoperability solutions we are honored they chose the HOOPS 3D
Application Framework as the core visualization engine for CADIQ. We are
certain the CADIQ customer base will be impressed with its new graphics
capabilities and the data link with the many other applications also
supporting the OpenHSF visualization standard. We look forward to helping
them quickly ship a successful, high-performance and graphically rich
product,” added Ron Fritz, Managing Partner, Tech Soft America.

About HOOPS 3D Application Framework
HOOPS 3D Application Framework (HOOPS/3dAF) is an extensible, high-level
component that dramatically simplifies the design, development and
maintenance of high-performance, interactive 2D/3D applications for Windows,
UNIX, LINUX, Windows CE devices or the Web.

Many leading developers of engineering software, including SolidWorks, PTC,
MSC.Software, Fluent, CADKEY, ITI TranscenData, SPSS, Surpac, Pam-Systems,
Sescoi and 150+ others rely on HOOPS technology in one or more shipping
applications to drastically reduce R&D costs, dramatically speed
time-to-market, enhance the graphics performance and functionality of their
applications and enable them to focus on their core competency.

About ITI TranscenData
ITI TranscenData is the product data interoperability business within
International TechneGroup Incorporated (ITI). ITI TranscenData provides
interoperability solutions that enable companies to effectively exchange,
reuse, and share engineering product data among diverse software
applications used throughout a manufacturing enterprise and it’s supply
chain. ITI TranscenData solutions are aimed directly at reducing and
eliminating non-value-added time and costs associated with reusing product
data. ITI TranscenData solutions are distributed worldwide through a
combination of direct sales, resellers, and strategic vendor/OEM partners.
The company maintains corporate headquarters in Milford, OH and can be
reached at www.transcendata.com.

About Tech Soft America
Tech Soft America (TSA) provides premier customer driven development tools,
consulting and support services enabling its partners to rapidly deliver
world-class technical software. TSA develops the HOOPS 3D Application
Framework, HOOPS Stream Toolkit and HOOPS Net Server, all components
designed to dramatically simplify the design, development and maintenance of
high-performance, interactive 2D and 3D applications built for PCs, UNIX
workstations, Linux and the Web. HOOPS technology has been incorporated into
over 150 commercial software applications, from a range of leading 2D/3D
application vendors. The company maintains corporate headquarters in
Oakland, California and can be reached at http://www.hoops3d.com.

Tech Soft America Press Contact:
Melle Amade-Vice
510-434-7630 x214
Email Contact

ITI Press Contact:
Robert Farrell
513-576-3900 x 3845
Email Contact

HOOPS is a registered trademark of Tech Soft.

CADIQ is a registered trademark of International TechneGroup Incorporated
TranscenData is a trademark of International TechneGroup Incorporated
All other brand and product names are trademarks or registered trademarks of
their respective owners.

Copyright (c) 2003 Tech Soft America.



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