WAYLAND, Mass.—(BUSINESS WIRE)—Sept. 2, 2004— Moldflow Corporation (NASDAQ: MFLO), the world leader in process-wide solutions for optimizing the design and manufacture of plastics injection molded products, today announces the completion of its first ever International Moldflow User Group Conference held in Tokyo, Japan. The event was co-hosted by 12 partner companies and drew nearly 150 attendees comprised of Moldflow customers from Japan, Korea and India.

Ken Welch, Moldflow's executive vice president and general manager of Design Analysis Solutions stated "Moldflow has a sizeable presence throughout Asia, especially in Japan. The User Group Conference gives us the opportunity to interact with our customers and to learn more about their applications as well as to get suggestions to improve and expand our product functionality."

The conference included presentations by senior Moldflow executives- Roland Thomas, president and CEO; Ken Welch; and Peter Kennedy, chief technology officer. The keynote speaker, Dr. Hidetoshi Yokoi, vice director of the Center of Collaborative Research at the University of Tokyo, presented visualization analysis of injection molding phenomena. Invited speakers Dr. Vito Leo, principal scientist at Solvay SA, Belgium, talked about bridging the gap between research and development and customer support, and Paul Van Huffel, senior engineer at Cascade Engineering, addressed molding boundaries associated with injection molding simulation as it relates to the use of MPI 5.0. In addition, the event offered many technical and user presentations as well as forums for special interest groups.

Van Huffel says of his experience at this event, "This was an ideal opportunity to interact with Moldflow users, exchange ideas and make suggestions for upcoming product releases. While I really appreciated the chance to be a keynote speaker at this year's Asian conference, I benefited greatly from the other technical and user presentations, as well as the chance to meet one-on-one with Moldflow representatives and customers."

The venue was also the Japanese debut for Moldflow's Manufacturing Solutions, a suite of solutions geared to help manufacturers optimize the efficiency of manufacturing processes. Moldflow also highlighted its recently announced Moldflow Plastics Insight(TM) (MPI(TM)) 5.0, the industry's most widely used design plastics analysis software.

To view images of the Moldflow 2004 Japan user conference, visit www.moldflow.com/imugjpn. For more information about upcoming Moldflow seminars and user meetings, visit www.moldflow.com and click on "News and Events."

About Moldflow Corporation

Moldflow (NASDAQ: MFLO) is the leading global provider of automation and optimization software, enabling hardware and hot runner process control solutions for the plastics injection molding industry. Companies use Moldflow's complete suite of products to address plastic part design issues at the earliest possible stage as well as to maximize productivity and profitability on the manufacturing floor. Moldflow Plastics Labs (MPL) offers state-of-the-art material testing and consulting services. Its extensive materials database is also used in Moldflow software products. Moldflow's collaboration with academia, industry, and customers around the world has led to a reputation for constant innovation in the complete design-for-manufacture process. Headquartered in Wayland, Massachusetts, Moldflow has offices, manufacturing, and research and development centers in the United States, Europe, Australia, and Asia. For more information, visit www.moldflow.com.

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Moldflow corporate contact:                  
Dawn Soucier, 508-358-5848                    

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Laura Carrabine, 440-247-8653                

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