International Wafer-Level Packaging Conference (IWLPC) Offers In-Depth Tutorials

Minneapolis, MN - August 11, 2011-- The SMTA and Chip Scale Review magazine are pleased to announce eight in-depth tutorials will be offered at IWLPC 2011.  Tutorials are application-oriented and structured to combine field experience with scientific research to solve everyday problems. The IWLPC will be held October 3-6, 2011 at the Santa Clara Marriott Hotel in Santa Clara, California. 

Tutorial Topics Include:
-    Achieving High Reliability of Lead-Free Soldering - Materials Consideration
-    Primer for the Design and Fabrication of Silicon Interposers
-    TSV and Key Enabling Technologies for 3D IC/Si Integration and WLP
-    MEMS Packaging and Reliability
-    Wafer Level Packaging
-    Chip Scale & Embedded Chip Packaging
-    IC Package Cost Reduction Using Supply Chain Modeling
-    Advanced Flip Chip Technology and Processing

This premier industry event explores leading-edge design, material, and process technologies focused on Wafer-Level Packaging applications. There will be special emphasis on the numerous device and end product applications (RF/wireless, sensors, mixed technology, optoelectronics) that demand wafer-level packaging solutions for integration, cost, and performance requirements.

Visit http://www.iwlpc.com for more information.

The SMTA membership is an international network of professionals who build skills, share practical experience and develop solutions in electronic assembly technologies, including microsystems, emerging technologies, and related business operations.

Chip Scale Review, now entering its 15th year, is the leading international magazine serving the semiconductor, IC and electronic device packaging market.




Contact:

Patti Hvidhyld
Tel.:952-920-7682
E-mail: Email Contact




Review Article Be the first to review this article
Rand3D

Featured Video
Jobs
Mechanical Engineer for Allen & Shariff Corporation at Pittsburgh, Pennsylvania
System Designer/Engineer for Bluewater at Southfield, Michigan
Mid-Level Mechanical Engineer for Kiewit at lenexa, Kansas
Product Manager for CHA Consulting, Inc. at Boston, Massachusetts
Geospatial Analyst/Programmer for LANDIQ at Sacramento, California
Software Developer for CHA Consulting, Inc. at Norwell, Massachusetts
Upcoming Events
Live SOLIDWORKS Event Hosted by Converge at 2482 Patterson Rd Unit 2 Grand Junction CO - May 22, 2018
ESPRIT World 2018 at Indianapolis Marriott Downtown 350 West Maryland Street Indianapolis IN - Jun 11 - 15, 2018
HxGN LIVE 2018 at The Venetian Las Vegas NV - Jun 12 - 15, 2018
IMTS2018 International Manufacturing Tech Show at McCormick Place Chicago IL - Sep 10 - 15, 2018
Kenesto: 30 day trial
MasterCAM



Internet Business Systems © 2018 Internet Business Systems, Inc.
25 North 14th Steet, Suite 710, San Jose, CA 95112
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation GISCafe - Geographical Information Services TechJobsCafe - Technical Jobs and Resumes ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise