Reportlinker Adds Global Electronic Thermal Management Industry

EBM-PAPST Introduces New Fan-Cooling Technology 36

Hybricon Introduces Liquid-Cooled ATR Chassis 36

Ansoft Launches Latest Version of ePhysics as ePhysics v2 37

CTS Launches New Line of Low-Profile Forged Heat Sinks 37

Honeywell Introduces Screen Printable Phase Change Material in

Chip Manufacture 37

Laird Launches Thermally Conductive, Electrically Insulating

T-preg™ HTD for PCBs 38

Laird Introduces Deep Drawing Capability for Shielding

Applications 38

Laird Introduces Low-Cost T-Gard™ for SMPS Devices 38

Laird Introduces T-Gard™ 500 High Performance Insulator for

Automotive Industry 39

Jaro Develops 450 CFM AC Cooling Fan for Industrial Use 39

Jaro Develops IC Cooling Fan With High Flow and Cooling Value 39

Mathis Develops Mathis TCi™ For Improved Thermal Conductivity

Testing 39

Melcor Introduces Extrusion Heat Sinks With Improved Performance 39

Fluent Launches New Environmental Thermal Audit Solution for

Data Centers 40

Kooltronic Introduces Advanced Enclosure Accessories 40

Pfannerberg Develops Filterfan® 40


Thermacore Snaps Up Pittsburgh Materials Technology 41

Parker Hannifin Takes Over SprayCool 41

Dow Kokam Acquires Societe de Vehicles Electriques 41

BorgWarner Establishes Manufacturing Plant 42

MAHLE Acquires Majority Stake in BEHR Industry 42

CoolIT Systems Takes Over Assets of Delphi Thermal Liquid Cooling 42

Curtiss-Wright Snaps Up EST Group 43

Arlington Capital Partners Acquires J.A. Reinhardt 43

Thermacore Takes Over k Technology 43

IBM Collaborates with Vette 44

Bias Power Collaborates with Nuventix 44

Roal Electronics Collaborates with Nuventix 45

Electronic Environments Inks Partnership Agreement with

AdaptivCool 45

Asetek Forms Alliance with Corsair 45

AdaptivCool and Yamatake Sign Agreement 46

Toyal America forms Alliance with E.W. Kaufmann 46

Stablcor and Elvia PCB Group Ink Licensing Agreement 46

Weidmann Electrical Technology and LumaSense Technologies Ink

Strategic Partnership Agreement 46

Thermacore Bags Contract from Defense Advanced Research

Projects Agency 47

Waytronx Takes Over CUI 47

Photochemie Signs Licensing Agreement with Stablcor 47

ON Semiconductor Establishes Research and Development Centre 48

Stablcor and Graphic Ink Licensing Agreement 48

Texas Instruments Takes Over Commergy Technologies 48

Thermal Energy International Takes Over Gardner Energy Management 48

nCoat Inks Agreement with BSR Solar Technologies and

Sunvention USA 48

CSP Inc. MultiComputer Division Signs Agreement with

SprayCool® Technologies 49

Mentor Graphics Takes Over Flomerics Group 49

Modine Divests Thermacore 49


Moog Takes Over Thermal Control Products 50

Rensselaer Teams Up with Varsities to Develop Cooling Techniques 50

Laird Partners with Sager Electronics 51

Honeywell to Expand R&D Facility 51

Vette Adds ERM 51

Laird Takes Over Supercool 52

Arlington Capital Acquires Woven Electronics Through Thermal

Solutions 52

Parker Hannifin Purchases Acofab and Adecem 52

Ametek Adds Land Instruments 52

Lytron Adds Lockhart Industries 53

Seki Technotron Purchases 10% Interest in sp3 Inc. 53

OnScreen Purchases Patent of WayCool Thermal Cooling Technology 53

Flomerics Acquires NIKA 54

Aavid Merges with Ansys and Spins-Off Thermal Management Business 54

Celsia and Yeh-Chiang Sign Agreement 54

Nextreme Inks License Deal with Caltech 54

Celsia Signs Sales & Development Pact with Lighting Science 55

Celsia Contracts with Kubo to Expand in Japan 55

Hybricon and Parker Hannifin Sign Pact for Cooling Solutions 55

Rogers and Thermal Transfer Composites Partner 56

sp3 Partners with CPS 56

Celsia Teams Up with AET 56

Mathis Forms Distribution Partnership with Setaram

Instrumentation 57


VI, Incorporated (US) 58

Marlow Industries (US) 58

Aavid Thermalloy, LLC (US) 58

Advanced Thermal Solutions, Inc. (US) 58

Alcoa, Inc. (US) 59

Alpha Technologies, Inc. (US) 59

Ametek, Inc. (US) 59

Amkor Technology, Inc. (US) 60

Ansys, Inc. (US) 60

Ansoft Corporation (US) 61

Fluent, Inc. (US) 61

ASAT Holdings Ltd. (Hong Kong) 61

Brush Engineered Materials, Inc. (US) 62

Ceramics Process Systems Corporation (US) 62

Chomerics (US) 62

Comair Rotron, Inc. (US) 63

Cookson Electronics Assembly Materials (US) 63

Cool Innovations, Inc. (US) 63

Cooler Master Co., Ltd. (UK) 64

C-Therm Technologies Ltd. (Canada) 64

CTS Corporation (US) 64

Daat Research Corp. (US) 65

Degree Controls, Inc. (US) 65

Dow Corning Corporation (US) 65

Dynatron Corporation (US) 65

Enertron, Inc. (US) 66

Ferraz Shawmut, LLC (Canada) 66

Fujikura Ltd. (Japan) 66

Henkel Loctite Corporation (US) 66

Honeywell Electronic Materials (US) 67

Intricast Company Inc (US) 67

ITW Vortec (US) 67

JARO Components, Inc. (US) 68

Kooltronic, Inc. (US) 68

Kyocera Corporation (Japan) 68

Laird Technologies (US) 68

Liebert Corporation (US) 69

Lord Corporation (US) 69

Lytron Incorporated (US) 69

Mentor Graphics Corporation (US) 69

Metal Matrix Cast Composites, LLC (US) 70

Micronel U.S. (US) 70

Netzsch Instruments, Inc. (US) 70

Netzsch Thermal Analysis (Germany) 70

NMB Technologies Corporation (US) 71

Noren Products, Inc. (US) 71

Orient Semiconductor Electronics Ltd. (Taiwan) 71

PC Power & Cooling, Inc. (US) 71

Pfannenberg, Inc. (US) 72

PLANSEE Thermal Management Solutions (US) 72

Sumitomo Electric Industries, Ltd. (Japan) 72

Tech Spray, L. P. (UK) 72

Tellurex Corp. (US) 73

Tennmax United (US) 73

The Bergquist Company (US) 73

The Filter Factory, Inc. (US) 74

Thermacore (US) 74

Transene Company, Inc. (US) 74

U.S. Toyo Fan Corporation (US) 75

United Thermal Engineering Corporation (US) 75

Vette Corp. (US) 75

Wakefield Thermal Solutions, Inc. (US) 76


Table 6: World Recent Past, Current & Future Analysis for

Electronic Thermal Management by Geographic Region - US,

Canada, Japan, Europe, Asia-Pacific (excluding Japan) and Rest

of World Independently Analyzed with Annual Sales Figures in

US$ Million for Years 2007 through 2015 (includes

corresponding Graph/Chart) 77

Table 7: World Historic Review for Electronic Thermal

Management by Geographic Region - US, Canada, Japan, Europe,

Asia-Pacific (excluding Japan), and Rest of World Markets

Independently Analyzed with Annual Sales Figures in US$

Million for Years 2001 through 2006 (includes corresponding

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