The Future of EDA and the Semiconductor Industry, One Man’s View

Jasper Design Automation Raises $7 Million in Series D Funding Jasper announced it has raised $7 million in Series D financing. The investment round was led by new investor, ZenShin Capital of Menlo Park. Joining the financing were existing investors: Accel Partners, Cambrian Ventures, Foundation Capital, InnovationsKapital, and Northzone Ventures. The funds will provide working capital to support Jasper’s self-sufficient operations and continued market and product expansion.

Tela Innovations Acquires Blaze DFM Tela Innovations, has acquired Blaze DFM, a supplier of technology to reduce power in advanced manufacturing process nodes. The acquisition brings Blaze DFM’s complete line of products and technologies, including Blaze MO™ power-optimization technology, into the Tela portfolio. Key engineering personnel will join the company to enable continuity of product development and support of customers. In 2008 Blaze announced an agreement with TSMC that launched the foundry’s PowerTrim™ Service. This exclusive service provides TSMC customers with a unique solution that blends Blaze DFM’s design technology with special tuned advanced semiconductor processes to improve power consumption.

Other EDA News

Synopsys CEO Aart De Geus to Speak at Morgan Stanley Technology Conference
ISQED 2009 Announces Multiple Interactive Tutorials
Azuro Launches Rubix™ Clock Concurrent Optimization Tool
OVM Extended to Efficiently Manage Coverage Metrics
Synopsys Enhances DesignWare DDR PHY IP with Service to Verify Signal Integrity
TI EDA Executive Mike Fazeli Joins Atrenta Team
Arena Solutions Announces Record Growth in New Bookings and Net Retention for the Fourth Quarter and Fiscal Year 2008
ISQED 2009 Announces Multiple Interactive Tutorials
AMD Selects Cadence Incisive Palladium Series to Verify Complex Graphics Design
QThink Design Services Adopts Magma's Titan and Talus to Implement Next-Generation Mixed Signal Designs
HP and Sun Microsystems Sign Multi-year Partnership Agreement for Solaris on HP ProLiant Servers
Open Text Helps to Reduce Infrastructure Costs and Improve Remote User Experience with Release of Exceed onDemand 7
MIPS Technologies Selects Berkeley Design Automation Analog FastSPICE™ Platform and AFS Nano™
SiSoft Wins DesignCon 2009 Best Paper Award for "A Simple Via Experiment"
Srikanth Chandrasekaran to Receive Accellera’s 2009 Technical Excellence Award at DVCon
Certess Announces the First C-Level Functional Qualification Tool
Synopsys, Powerchip and Nikon Collaborate on 42-nm Flash Memory Optimization
Altium Further Extends the Appeal and Ease of FPGA-Based Design
Tela Innovations Acquires Blaze DFM
20 Electronics Industry Leaders Collaborate to Accelerate Development and Adoption of Design for e-beam Technology
Srikanth Chandrasekaran to Receive Accellera's 2009 Technical Excellence Award at DVCon on Wednesday, February 25, 2009, Doubletree Hotel, San Jose, California
Magma's Latest Version of Talus Vortex Delivers Industry-Best Quality of Results for Advanced Designs (Magma)
Agilent Technologies Announces High-Frequency/High-Speed EDA Release for Integrated Circuit, Package and Board Co-Design
Teklatech’s FloorDirector™ Tool Compatible with Sigrity’s XcitePI Power Integrity Simulation Flow
SpringSoft Agrees to Acquire Certess
Tieto Joins Atrenta’s SpyLinks™ Partner Program
Mentor Graphics Appoints General Managers
Industry's First Low Power Verification Methodology Manual, Authored by ARM, Renesas Technology and Synopsys, is Now Available
Jasper Design Automation Introduces Design Activation Services To Promote IP and Design Reuse, Driving Higher Customer ROI
Zocalo Tech, Inc. Introduces First EDA Tool Dedicated to Assertion Library Productivity
Simulation Helps Keep One of World’s Top Data Centers Cool (Mentor Graphics)
Epson’s Semiconductor Division Extends Deployment of SpringSoft Automated Debug System
Accellera Invites EDA Community to Attend Its Luncheon, OVL Survey and Technical Excellence Award Presentations at DVCon
Mark Your Calendars: DVCon 2009 to Deliver Rich Technical Program
Magma Enhances SiliconSmart With New Functional Recognition Capabilities, Speeding Modeling of Complex Standard Cells and I/Os
Synopsys Posts Strong Financial Results for First Quarter Fiscal Year 2009
Mentor Graphics’ Walden Rhines and Intel’s Paolo Gargini Receive Prestigious IEC Fellow Awards at DesignCon 2009
HP Reports First Quarter 2009 Results
LSI Corporation Selects Synopsys as Its Primary EDA Partner
Jasper Design Automation Raises $7 Million in Series D Funding
Independent BDTI Benchmarks Recognize CEVA-TeakLite-III as Most Area Efficient and Energy Efficient of all Processors in Its Class
ARTEMISIA Association and DATE 09 Conference Join Forces

Other Embedded, IP & SoC News

Toshiba Adds 40V, 60V and 80V MOSFETs for Isolated DC-DC Bus Converters Using Sixth Generation High Speed Process for High Power Efficiency
STMicroelectronics Increases Power Output of Portable Stereo Amplifiers Featuring 3D Audio Capabilities
Atmel Introduces the First IEEE P802.15.4c Compliant RF Transceiver Tailored to the Chinese Wireless Market
SMSC Introduces Industry’s Smallest, Full-Featured 7-Port Hi-Speed USB 2.0 Hub Controller
AMD Demos Upcoming Six-core “Istanbul” Server Processor
IAR Systems: Faster ARM Cortex-M3 Processor Debugging with New Release of IAR Embedded Workbench
Economic Reality Will Drive a 22% Decline in Global Semiconductor Sales This Year, IDC Says
Lime Microsystems selects Jazz Semiconductor’s 0.18-micron SiGe process for its Configurable Multi-band, Multi-standard Transceiver Targeting WCDMA, CDMA, LTE and WiMAX Femtocells
MOSAID Expands Into New Markets with Acquisition of 300 Communications Patents
Maxim and Universal Electronics Purchase Zilog Universal Remote Control and Secure Transaction Businesses
Innovative Logic announces USB3.0 Device Controller IP
ARC International plc Announces Unaudited Preliminary Results For the Year Ended December 31, 2008
NextIO Adopts Denali's Verification IP for New PCI Express Expansion and I/O Virtualization Module for Blade Systems
Rambus to Host Conference Call to Discuss Recent Legal Developments
ON Semiconductor Launches 6-Watt LED Driver with Integrated DC-DC Boost Converter for Larger LCD Panel Backlighting
STMicroelectronics Promotes Green Power for Electronics
TSMC and Tela Innovations Announce Strategic Partnership to Enhance Design and Process Co-Optimization
In Another Favorable Preliminary Ruling, U.S. Patent & Trademark Office Rejects All Claims of Third Patent Asserted Against Aruba Networks by Motorola
Micron Technology Responds to Continued Decreases in Demand
Court Grants Rambus Supplemental Damages in Hynix Case and Orders Negotiation of Compulsory License
SRS Labs Reports Fourth Quarter and Year End 2008 Results
Sundance SMT712 Module Optimized for High Bandwidth Applications Enabled by PXI Express. Expands SundancePXI Express Multiprocessor Solutions
Accordance Launches 1U Height M200 eSATA/SATA RAID Controller with Two 2.5 Inch Laptop Drives for industrial and embedded applications
ARM Showcases Innovation in Mobile Technology at 2009 GSMA Mobile World Congress

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Review Article
  • Great interview. Very insightful.... March 05, 2009
    Reviewed by 'EDA Observer'
    Thank you Mr Horgan for this insightful interview. I remember when Cadence acquired CCT.
    Paying $1 billion for a comapany with just $15 million in revenues shows how Cadence-Synopsys rivalry and their legal battles in the context of an "irrationally exuberant" stock (and M&A) market fueled decisions by Cadence exectives that explain partially why Cadence is where it is today.

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  • Full circle or Half circle?? March 04, 2009
    Reviewed by 'Anil Nadig'
    We started the semiconductor industry with one company coming up with the architecture, write the RTL, do the layout with thier in-house tools and fabricate in their own fab (AKA IDMs). Then we shed the fabrication saying its too costly to maintain and invest in RnD (The Foundary company?), and then the in-house tools sayings its cumbersome to develop (EDA vendors?) and spawned off the layout-ing to a third party saying too much overhead because of fixed costs (Esilicon?). But the future seems to be "specalized" "Value chain producers" with access to foundry to be able to have insight into nanometer issues (DFM?) and in-house developed tools with the knowledge gained from foundry to have edge over competitors. Which means the future seems to be putting back atleast half (in-house foundry and in-house tools) of the things, that we shed for various reasons into, one company. Half circle?? May be a day will come when you may want to integrate these "specialized" "value chain producers" back to the architucture and RTL team for some reason thats not yet foreseen. That would be the full circle!!!. At least the near to middle term seems to be the half circle for sure.

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  • The Future of EDA March 03, 2009
    Reviewed by 'Jeff Liu'
    The Future of EDA and the Semiconductor Industry, One Man’s View

      One person of 3 found this review helpful.

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