Patent Infringement Lawsuit Filed Against Ansoft/ANSYS

SANTA CLARA, Calif.—(BUSINESS WIRE)—August 18, 2008— Sigrity, Inc., known for its power integrity and signal integrity software solutions for integrated circuits, IC packages and printed circuit boards, announced today that it filed a lawsuit with The Research Foundation of State University of New York against Ansoft Corp. and ANSYS, Inc. for infringement of U.S. Patent No. 5,504,423 (the 423 patent), titled "Method for Modeling Interactions in Multilayered Electronic Packaging Structures. The Research Foundation is the owner and Sigrity is the exclusive licensee of the 423 patent. The suit, pending in United States District Court in Albany New York, was filed on July 21, 2008 against Ansoft and alleges that Ansofts products, including its SIwave product, infringe the 423 patent. An amended complaint adding ANSYS as a defendant was filed on August 5, 2008 as a result of ANSYSs acquisition of Ansoft, which was effective July 31, 2008.

About Sigrity

Sigrity, Inc., a privately held U.S. company incorporated in 1998, delivers advanced software solutions for package physical design and for analyzing power and signal integrity in chips, packages and printed circuit boards. Sigritys patented electrical analysis methodologies run orders of magnitude faster than general-purpose electromagnetic tools. More than 170 leading companies in the semiconductor, computer, graphics, communications and networking industries use Sigrity products to achieve high performance and reduce time to market. Sigrity is headquartered in Santa Clara, Calif., with R&D, sales and support offices worldwide. For more information about Sigrity, please visit: http://www.sigrity.com.

Sigrity and the Sigrity are trademarks of Sigrity, Inc. All other brands, product names and marks are the property of their respective owners.



Contact:

Sigrity, Inc.
Leslie Landers, 408-260-9344 ext. 148
Email Contact
or
ThinkBold Corporate Communications for Sigrity
Sarah Miller, 231-264-8636
Email Contact




Review Article Be the first to review this article
Rand3D

SolidCAM: SolidCAM Dec 2017 Campaign Save 28 percent

Featured Video
MCAD Corporate Newsletter
rss feed
Jobs
Mechanical Design Engineer 3 for KLA-Tencor at Milpitas, CA
Sr Mechanical Design Engineer for Medtronic at mounds view, MN
Geospatial Analyst - Senior for BAE Systems Intelligence & Security at Springfield, VA
Geospatial Systems Administrator for BAE Systems Intelligence & Security at arnold, MO
Senior Mechanical Engineer for BAE Systems Intelligence & Security at Arlington, VA
Urban Designer - Urban Design/Planning for SERA Architects, Inc at Portland, OR
Upcoming Events
ESPRIT World 2018 at Indianapolis Marriott Downtown 350 West Maryland Street Indianapolis IN - Jun 11 - 15, 2018
HxGN LIVE 2018 at The Venetian Las Vegas NV - Jun 12 - 15, 2018
IMTS2018 International Manufacturing Tech Show at McCormick Place Chicago IL - Sep 10 - 15, 2018
Kenesto: 30 day trial



Internet Business Systems © 2017 Internet Business Systems, Inc.
25 North 14th Steet, Suite 710, San Jose, CA 95112
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation GISCafe - Geographical Information Services TechJobsCafe - Technical Jobs and Resumes ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise