Patent Infringement Lawsuit Filed Against Ansoft/ANSYS

SANTA CLARA, Calif.—(BUSINESS WIRE)—August 18, 2008— Sigrity, Inc., known for its power integrity and signal integrity software solutions for integrated circuits, IC packages and printed circuit boards, announced today that it filed a lawsuit with The Research Foundation of State University of New York against Ansoft Corp. and ANSYS, Inc. for infringement of U.S. Patent No. 5,504,423 (the 423 patent), titled "Method for Modeling Interactions in Multilayered Electronic Packaging Structures. The Research Foundation is the owner and Sigrity is the exclusive licensee of the 423 patent. The suit, pending in United States District Court in Albany New York, was filed on July 21, 2008 against Ansoft and alleges that Ansofts products, including its SIwave product, infringe the 423 patent. An amended complaint adding ANSYS as a defendant was filed on August 5, 2008 as a result of ANSYSs acquisition of Ansoft, which was effective July 31, 2008.

About Sigrity

Sigrity, Inc., a privately held U.S. company incorporated in 1998, delivers advanced software solutions for package physical design and for analyzing power and signal integrity in chips, packages and printed circuit boards. Sigritys patented electrical analysis methodologies run orders of magnitude faster than general-purpose electromagnetic tools. More than 170 leading companies in the semiconductor, computer, graphics, communications and networking industries use Sigrity products to achieve high performance and reduce time to market. Sigrity is headquartered in Santa Clara, Calif., with R&D, sales and support offices worldwide. For more information about Sigrity, please visit: http://www.sigrity.com.

Sigrity and the Sigrity are trademarks of Sigrity, Inc. All other brands, product names and marks are the property of their respective owners.



Contact:

Sigrity, Inc.
Leslie Landers, 408-260-9344 ext. 148
Email Contact
or
ThinkBold Corporate Communications for Sigrity
Sarah Miller, 231-264-8636
Email Contact




Review Article Be the first to review this article
HP

ACE2017

Featured Video
Editorial
Jeff RoweJeff's MCAD Blogging
by Jeff Rowe
APSX Bringing Injection Molding To The Desktop
Jobs
Inside Sales for SolidCAM at Newtown, PA
Director of Mechanical Engineering for Velodyne LIDAR at Morgan Hill, CA
Sr. GIS Technical Analyst for Southern California Edison SCE Transmission and Distribution Organization at Rosemead, CA
Imagery Analyst for ARA at Albuquerque, NM -1229, NM
Architetural Project Manager for DRA Architects at Irvine, CA
Architect for North County Transit District at Oceanside, CA
Upcoming Events
DriveWorks World at The Barley Store Laskey Lane Thelwall Cheshire United Kingdom - Mar 6 - 9, 2017
JEC World 2017 at Paris Nord Villepinte Exhibition Centre Paris France - Mar 14 - 16, 2017
SOLIDWORKS funding event – Leicester at The National Space Centre, Exploration Dr, Leicester, LE4 5NS Leicester United Kingdom - Mar 17, 2017
ACE 2017 Nashville at Nashville TN - Mar 21 - 23, 2017
SolidCAM: Patented Wizard to optimal feeds & speeds



Internet Business Systems © 2017 Internet Business Systems, Inc.
595 Millich Dr., Suite 216, Campbell, CA 95008
+1 (408)-337-6870 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation GISCafe - Geographical Information Services TechJobsCafe - Technical Jobs and Resumes ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy Policy Advertise