High Growth Forecasted for the World Electronic Thermal Management Market

LONDON, UNITED KINGDOM -- (MARKET WIRE) -- Mar 26, 2008 -- Reportlinker.com announces that a new market research report related to the Electronics industry is available in its catalogue.

World Electronic Thermal Management Market

This report analyzes the worldwide markets for Electronic Thermal Management in Millions of US$. The major end-use segments analyzed are Computers, Telecom, Medical/Office Equipment, Industrial/Military, Consumer Electronics, and Automotive. Also, the report provides market analytics for the Global and US market for the product segments - Electronic Thermal Management Hardware, Electronic Thermal Management Software, and Electronic Thermal Management Interfaces & Substrates. Annual forecasts are provided for each region and product segment for the period of 2003 through 2012. The report profiles 160 companies including many key and niche players worldwide such as II-VI, Incorporated, Marlow Industries, Aavid Thermalloy, LLC, Advanced Thermal Solutions, Inc., Alcoa, Inc., Alpha Metals, Alpha Technologies Group, Inc., Ametek, Inc., Amkor Technology, Inc., Ansoft Corporation, Ansys, Inc., Fluent, Inc., ASAT Holdings Ltd., Brush Engineered Materials, Inc., CTS Corporation, Comair Rotron, Inc., Ceramics Process Systems Corporation, Chomerics, Cool Innovations, Inc., Cooler Master Co., Ltd., Daat Research Corp., Degree Controls, Inc., Dow Corning Corporation, Dynatron Corporation, Enertron, Inc., Flomerics, Fujikura Ltd., Henkel Loctite Corporation, Honeywell Electronic Materials, Isonics Corporation, Intricast Company Inc., ITW Vortec, JARO Components, Inc., Kooltronic, Inc., Kyocera Corporation, Laird Technologies, Liebert Corporation, Lord Corporation, Lytron Incorporated, Mathis Instruments Ltd, Melcor Corporation, Metal Matrix Cast Composites, LLC, Micronel U.S., Netzsch Instruments, Inc., Netzsch Thermal Analysis, NMB Technologies Corporation, Noren Products, Inc., Orient Semiconductor Electronics Ltd., PC Power & Cooling, Inc., Pfannenberg, Inc., PLANSEE Thermal Management Solutions, R-Theta Thermal Solutions, Inc., Sumitomo Electric Industries, Ltd., Tech Spray, L. P., Tellurex Corp., The Bergquist Company, The Filter Factory, Inc., Thermacore, Transene Company, Inc., Tennmax United, U.S. Toyo Fan Corporation, United Thermal Engineering Corporation, Vette Corp., and Wakefield Thermal Solutions, Inc. Market data and analytics are derived from primary and secondary research. Company profiles are mostly extracted from URL research and reported select online sources.



Study Reliability and Reporting Limitations I-1

Disclaimers I-2

Data Interpretation & Reporting Level I-2

Quantitative Techniques & Analytics I-3

Product Definitions and Scope of Study I-3

End-Use Segments I-4

Computers I-4

Telecom I-4

Medical/Office Equipment I-4

Industrial/Military I-4

Consumer Electronics I-4

Automotive I-4

Product Segments I-5

Hardware I-5

Software I-5

Interfaces and Substrates I-5


1. Industry Overview II-1

Sophisticated Technology Needs Effective Thermal Management II-1

Current and Future Analysis II-1

Regional Perspective II-1

End-Use Perspective II-1

Product Segment Perspective II-2

2. Market Trends II-3

Rising Complexities Present Lucrative Opportunities for Electronic Thermal Management II-3

PC Market Stimulates Growth II-3

Thermal Management Subsystems Set for Robust Growth II-3

New Technologies Under Development II-3

Liquid Cooling Gaining Foothold II-4

Semiconductor Manufacturers Look for Thermal Management Technology II-4

Heat Pipe Gains Popularity among PC Manufacturers II-4

Imminent Growth for ICs II-5

3. Product Overview II-6

Thermal Management - A Critical Function II-6

Electronic Thermal Management Products II-6

Hardware II-6

Heat Sinks II-6

Heat Pipes II-7

Micro Channels II-7

Spray Cooling II-7

Electronic Cooling Fans II-7

Metal Backplanes II-7


Software II-8

Computational Methods of Heat Transfer (CHT) and Fluid Dynamics (CFD) II-8

Electronic Design Automation (EDA) Software, Electronic Computer Aided Design (ECAD) Software, and Technology Computer Aided Design (TCAD) Software II-8

Interfaces and Substrates II-9

Thermal Compounds and Thermal Interface Materials II-9 Thermal Management Applications II-10

Computers II-10

Notebooks/Laptops II-10

Servers II-10

Embedded PCs II-11

Telecom II-11

Medical II-11

Industrial Electronics II-11

Aerospace/Military II-11

Consumer Electronics II-12

Automotive II-12

4. Competitive Environment II-13

Thermal Management - A Fragmented Market II-13

Table 1: Leading Vendors in the Worldwide Thermal Management Market (2006 & 2007) - Percentage Breakdown by Value Sales for Amkor, Aavid Thermalloy, Fluent, Chomerics, Kyocera, and Others (includes corresponding Graph/Chart) II-13

Thermal Management Hardware Market II-13

Table 2: Leading Players in the Worldwide Thermal Management Hardware Market (2006 & 2007) - Percentage Breakdown by Value Sales for Aavid Thermalloy, Thermacore, Lytron, and Others (includes corresponding Graph/Chart) II-14

Fluent - The Undisputed Thermal Management S/W Market Leader II-14 Table 3: Leading Players in the Worldwide Thermal Management Software Market (2006 & 2007) - Percentage Breakdown by Value Sales for Fluent, Ansys, Flomerics, Daat, and Others (includes corresponding Graph/Chart) II-14

Chomerics and Bergquist Lead Thermal Management Interface Market II-15

Table 4: Leading Players in the Worldwide Thermal Management Interface Market (2006 & 2007) - Percentage Breakdown by Value Sales for Chomerics, Bergquist, Aavid Thermalloy, Lytron, and Others (includes corresponding Graph/Chart) II-15

Amkor Dominates Thermal Management Substrate Market II-15

Table 5: Leading Players in the Worldwide Thermal Management Substrate Market (2006 & 2007) - Percentage Breakdown by Value Sales for Amkor, Kyocera, ST ChipPAC, OSE, ASAT, and Others (includes corresponding Graph/Chart) II-15

5. Technological Development II-16

Heat Alleviation Technologies for Electronics II-16

6. Product Developments/Introductions II-17

SMART Releases Liquid-Cooled VLP DDR2 Registered DIMMs II-17

LORD Develops Materials for Thermal Management II-17

Dow Corning Introduces New Thermally Conductive Compound II-17

Astrosyn Unveils a Range of Slide-fit Heatsink Enclosures II-17

Dell Develops a Liquid-Cooled Heat Sink II-18

Fujipoly America Develops an Innovative Thermal Interface Material II-18

Flomerics to Offer T3Ster Thermal Testing System II-18

Andigilog® Develops ThermalEdge™ Cooling Technology II-18

Andigilog® Introduces Thermal Management Solutons II-19

Celsia Releases MicroSpreader™ II-19

Sunon Develops Liquid Circulation Cooling System II-19

EBM-PAPST Develops Advanced Liquid Cooling System II-20

EBM-PAPST Introduces New Fan-Cooling Technology II-20

Hybricon Introduces Liquid-Cooled ATR Chassis II-20

Ansoft Launches Latest Version of ePhysics as ePhysics v2 II-20

CTS Launches New Line of Low-Profile Forged Heat Sinks II-21

Honeywell Introduces Screen Printable Phase Change Material in Chip Manufacture II-21

Laird Launches Thermally Conductive, Electrically Insulating T-preg™ HTD for PCBs II-21

Laird Introduces Deep Drawing Capability for Shielding Applications II-22

Laird Introduces Low-Cost T-Gard™ for SMPS Devices II-22

Laird Introduces T-Gard™ 500 High Performance Insulator for Automotive Industry II-22

Jaro Develops 450 CFM AC Cooling Fan for Industrial Use II-22

Jaro Develops IC Cooling Fan With High Flow and Cooling Value II-23

Mathis Develops Mathis TCi™ For Improved Thermal Conductivity Testing II-23

Melcor Introduces Extrusion Heat Sinks With Improved Performance II-23

Fluent Launches New Environmental Thermal Audit Solution for Data Centers II-23

Kooltronic Introduces Advanced Enclosure Accessories II-23

Pfannerberg Develops Filterfan® II-24

Vette Introduces BGA Thermal Solutions II-24

Sp3 Launches New DiaThermm™ Diamond Heat Spreaders II-24

Andigilog Releases SC7511 as First in the Series of Intelligent Thermal Management Products II-25

Degree Controls' Develops Cooling Products II-25

Dow Corning Launches Innovative Thermal Management Solutions II-26

CPS' Metal Matrix Combination Delivers Sophisticated Thermal Management II-27

7. Recent Industry Activity II-28

Moog Takes Over Thermal Control Products II-28

Rensselaer Teams Up with Varsities to Develop Cooling Techniques II-28

Laird Partners with Sager Electronics II-29

Honeywell to Expand R&D Facility II-29

Modine to Divest Thermacore II-29

Vette Adds ERM II-29

Laird Takes Over Supercool II-30 Arlington Capital Acquires Woven Electronics Through Thermal Solutions II-30

Parker Hannifin Purchases Acofab and Adecem II-30

Ametek Adds Land Instruments II-30

Lytron Adds Lockhart Industries II-31

Seki Technotron Purchases 10% Interest in sp3 Inc. II-31

OnScreen Purchases Patent of WayCool Thermal Cooling Technology II-31

Flomerics Acquires NIKA II-32

Aavid Merges with Ansys and Spins-Off Thermal Management Business II-32

Celsia and Yeh-Chiang Sign Agreement II-32

Nextreme Inks License Deal with Caltech II-32

Celsia Signs Sales & Development Pact with Lighting Science II-33

Celsia Contracts with Kubo to Expand in Japan II-33

Hybricon and Parker Hannifin Sign Pact for Cooling Solutions II-33

Rogers and Thermal Transfer Composites Partner II-34

sp3 Partners with CPS II-34

Celsia Teams Up with AET II-34

Mathis Forms Distribution Partnership with Setaram Instrumentation II-34

Pentair Takes Over APW's Thermal Management Operations II-35 Helix Acquires IGC Polycold II-35

iCurie Signs Marketing and Sales Agreement with Advanced Energy Technology II-35

ISR Enters into Agreement with US Air Force to Develop Advanced Thermal Management System for Military Aircrafts II-36

Symmetry Electronics to Market Andigilog's Thermal Management System II-36

ISR Starts Commercial Division for Advanced Electronics II-37

Vette Takes Over Shun Fu Metal Products II-37

Laird Acquires Thermagon II-38

AMETEK Acquires Hughes-Treitler II-38

8. Focus on Select Global Players II-39

II-VI, Incorporated (USA) II-39

Marlow Industries (USA) II-39

Aavid Thermalloy, LLC (USA) II-39

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