ATopTech Signs Multi-year, Multi-million Dollar Contract with Broadcom

Aprisa allows Broadcom to leverage next generation place and route tools for designing ICs at 65 nm and below

Santa Clara, CA-December 10, 2007-ATopTech, Inc. today announced that it has entered into a multi-million dollar per year, multi-year contract with Broadcom Corporation (Nasdaq: BRCM), a global leader in wired and wireless broadband communications semiconductors. Broadcom will use ATopTech's next generation place and route software for designing integrated circuits at 65nm and below. Broadcom's first chip using ATopTech's software has already taped-out and had first pass silicon success.

"ATopTech offers a high quality solution to our 65nm closure efforts," said Neil Kim, Senior Vice President of Central Engineering at Broadcom. "As we continue to provide market leading products, we are excited to add ATopTech into our portfolio of place and route technologies."

ATopTech announced its entry into the EDA market on December 10, 2007- see The company's first product family, Aprisa, based on its Interconnect Centric Precision Optimization technology offers real design closure at 90nm and below.

"We are very pleased to announce this contract with Broadcom so soon after the release of the product," said Eric Thune, Vice President, Sales and Marketing at ATopTech. "Broadcom's use confirms the need for next generation place and route tools. We look forward to a productive long term relationship."

About ATopTech
ATopTech Inc. is a technology leader in IC physical design. Its Precision Optimization technology offers real design closure at 90nm and below. The company's first product family, Aprisa, has extremely close correlation to golden sign-off tools, produces design rule check (DRC)-clean designs, 10-15% better timing and up to 10 percent less standard cell area than existing tools. ATopTech Inc. was founded 2003 by Kaiwin Lee PhD, and Don-Min Tsou PhD, who with their team are some of the most experienced and successful developers of commercial physical design tools in the world. For more information, see

All trademarks or trade names mentioned are the property of their respective owners.

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