Front Silver Contacts
The four products in this family yield greater power output, they fire through silicon nitride anti-reflective coatings, and also provide a broad processing window. They are compatible with all Ferro rear silver pastes as well as lead-free and low-bow aluminum pastes.
In addition, two of the products offer the advantages of Ferro's patented Hot Melt ink technology. This specially designed silver conductor system eliminates the drying process of conventional pastes, resulting in higher throughput rates, increased productivity, improved yields, and reduction of volatile organic compounds (VOCs). Solid at room temperature, Hot Melt pastes are resistively heated above their melting points to screen print similarly to conventional thick film pastes. Unlike conventional pastes, they instantly re-solidify when transferred to the solar cell surface and are ready for the next printing sequence. This unique property also enables printing finer grid lines, contributing to a higher cell efficiency than can be achieved with conventional screen printing materials.
Ferro's new lead- and cadmium-free aluminum/boron conductor is designed for the back surface of thin silicon wafers. It exhibits less than 1 millimeter camber on 150 x 150 millimeter wafers at 160 microns thickness, enabling solar cell manufacturers to reduce silicon usage and costs. It also yields a smooth surface and high electrical efficiency.
A new lead-free aluminum conductor for the back surface of silicon wafers is specially formulated to facilitate firing through silicon nitride anti-reflective coatings. It exhibits less than 1 millimeter camber on 150 x 150 millimeter wafers at 200 microns thickness, and provides a smooth surface and high electrical efficiency.
High Adhesion Rear Silvers
These two products are cadmium-free silver conductor pastes designed to provide high adhesion with lead-free and leaded tabbing ribbon as well as improved electrical performance. One is formulated as a conventional screen printing ink, and the other offers the additional manufacturing benefits of Ferro's Hot Melt ink technology. Both are compatible with all Ferro leaded and lead-free aluminum inks, and have excellent solderability when used with leaded and lead-free solders.
All eight new products are RoHS-compliant.
About Ferro Electronic Material Systems
Ferro Electronic Material Systems has locations in Vista, CA; Penn Yan and Niagara Falls, NY; South Plainfield, NJ; Haverhill, United Kingdom; Uden, The Netherlands; Hanau, Germany; Tsukuba, Japan; and Suzhou, China. Its products include metal pastes and powders for solar energy applications, advanced packaging and thick film conductors; chemical mechanical planarization (CMP) slurries for semiconductors and advanced integrated circuits; dielectrics used in chip components and multilayer ceramic capacitors (MLCC); and surface finishing materials for LCD, hard disk, and ophthalmic polishing.
About Ferro Corporation
Ferro Corporation is a leading global supplier of technology-based performance materials for manufacturers. Ferro materials enhance the performance of products in a variety of end markets, including electronics, solar energy, telecommunications, pharmaceuticals, building and renovation, appliances, automotive, household furnishings, and industrial products.
Headquartered in Cleveland, Ohio, the Company has approximately 6,700 employees globally and reported sales of $2.0 billion in 2006. Additional information about the Company can be found at www.ferro.com.
Cautionary Note on Forward-Looking Statements
Certain statements in this Ferro press release may constitute "forward-looking statements" within the meaning of Federal securities laws. These statements are subject to a variety of uncertainties, unknown risks and other factors concerning the Company's operations and business environment, which are difficult to predict and often beyond the control of the Company.
Important factors that could cause actual results to differ materially from those suggested by
these forward-looking statements, and that could adversely affect the Company's future financial performance, include, but are not limited to the following:
-- the availability and cost of raw materials and other supplies;
-- intense competition in the markets the Company serves;
-- successful execution of projects designed to improve operating margins;
-- successful execution of restructuring programs to improve manufacturing efficiency and reduce costs;
-- the unpredictability and cyclicality of demand in the Company's markets;
-- exposure to currency conversion and changing global economic, social and political conditions;
-- the Company's ability to compete lawfully with local competitors in the Asia/Pacific region;
-- aggressive global regulation of hazardous materials could affect sales of our products;
-- costs of compliance with stringent environmental, health, and safety regulations;
-- access to capital markets or borrowings;
-- variable interest rates on some of our external borrowings could increase;
-- encumbrances on the Company's assets granted to lenders affect our flexibility to dispose of assets;
-- restrictive covenants in our credit facilities could affect our flexibility in funding strategic initiatives;
-- the Company's ability to utilize significant deferred tax assets;
-- the outcome of any legal claims against the Company;
-- the Company's ability to continuously introduce new products to respond to demand;
-- the uncertainty of future employee benefit costs and the impact of funding of those costs; and
-- risks associated with acts of God, terrorists, and others, as well as fires, explosions, wars, riots, accidents, embargos, natural disasters, strikes and other work stoppages, quarantines and other governmental actions, and other events or circumstances that are beyond the Company's reasonable control.
Additional information regarding these risk factors can be found in the Company's Annual Report on Form 10-K for the period ended December 31, 2006.
This release contains time-sensitive information that reflects management's best analysis only as of the date of this release. The Company does not undertake any obligation to publicly update or revise any forward-looking statements to reflect future events, information or circumstances that arise after the date of this release.
Ferro Electronic Material Systems
Todd Williams, Product Line Manager
E-mail: Email Contact
Mary Abood, Director, Corporate Communications
E-mail: Email Contact
David Longfellow, Director, Investor Relations
E-mail: Email Contact