PALO ALTO, Calif.—(BUSINESS WIRE)—March 7, 2007— HP (NYSE: HPQ) today announced benchmark results confirming the HP BladeSystem c-Class uses up to 27 percent less power than the IBM BladeCenter-H in similar configurations that reflect real-world customer usage of blade server environments.(1)
The results derive from a week-long study conducted by Sine Nomine
Associates of Ashburn, Va., which examined the overall power
consumption and external airflow requirements of a variety of blade
server and 1U rack server configurations in a typical data center
environment experiencing light to heavy use.
The documented and publicly available results demonstrate that the
HP BladeSystem c-Class and its zoned cooling properties not only lower
power usage through efficient power distribution but also optimize
airflow, which is a significant component in keeping data centers
cool. In fact, the benchmark study shows the HP BladeSystem c-Class
requires 60 percent less airflow than the IBM BladeCenter-H.
HP, the new industry leader in factory revenues and units shipped
for blade servers,(2) features HP Thermal Logic technology in its
BladeSystem enclosure to offer customers reduced power and cooling
loads right out of the box.
"Power and cooling are serious issues for customers," said Mark
Potter, vice president, BladeSystem Division, HP. "Sine Nomine took an
objective look at this real-world customer problem and the test
results show what we already knew: HP BladeSystem c-Class featuring
Thermal Logic is the clear choice for customers addressing their power
and cooling challenges."
HP offers broad power and cooling portfolio
Recent industry studies reveal that data center power density has
increased more than tenfold in the last 10 years and that, in some
cases, cooling represents upwards of 70 percent of the total data
center power spend for customers.(3) These costs are driven by the
data center power requirements and the cubic feet per minute of
While some vendors focus on single aspects of the data center
power and cooling problem, HP takes a holistic approach to synchronize
power efficiency across multiple elements. Systems taking advantage of
this approach include the HP BladeSystem c-Class and the recently
announced data center-wide HP Dynamic Smart Cooling solution.
Additionally, HP has a large patent portfolio covering advances in
power and cooling technology in the past 10 years. HP continues to
address power efficiency issues across the data center by introducing
new technology solutions to meet the needs of its customers,
particularly those building next-generation data centers. Customers
today benefit from HP Thermal Logic featuring HP Active Cool Fans and
Dynamic Power Saver, HP Dynamic Smart Cooling, HP Modular Cooling
System, HP Power Regulator and HP Insight Power Manager.
Energy efficiency has been a key aspect of HP's environmental
strategy since 1992. The company offers a full range of
energy-efficient products and enterprise solutions that help customers
save money while reducing environmental impact.
The full version of the Sine Nomine study is available at
www.hp.com/go/bladepowerreport. More information on HP power and
cooling technologies for businesses is available at
www.hp.com/go/powerandcooling. More information on Sine Nomine is
available at www.sinenomine.net.
HP focuses on simplifying technology experiences for all of its
customers - from individual consumers to the largest businesses. With
a portfolio that spans printing, personal computing, software,
services and IT infrastructure, HP is among the world's largest IT
companies, with revenue totaling $94.1 billion for the four fiscal
quarters ended Jan. 31, 2007. More information about HP is available
Note to editors: More news from HP, including links to RSS feeds,
is available at www.hp.com/hpinfo/newsroom/.
(1) Sine Nomine Associates, "A Comparison of HP BladeSystem
c-Class with HP Thermal Logic to Competitive Systems," Feb. 2, 2007.
(2) IDC Worldwide Quarterly Server Tracker, February 2007.
(3) Malone, C., Belady, C. "Metrics to characterize Data Center &
IT Equipment Energy Use," Proceedings of 2006 Digital Power Forum,
Richardson, Texas, September 2006.
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(C) 2007 Hewlett-Packard Development Company, L.P. The information
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