DesignCon 2007 Exhibition Plays Host To Cutting-Edge Design Tools

CHICAGO—(BUSINESS WIRE)—January 17, 2007— The International Engineering Consortium (IEC) hosts a record-breaking number of exhibitors at DesignCon 2007, which takes place this January 29 through February 1 at the Santa Clara Convention Center in Santa Clara, CA.

IEC President John Janowiak commented, "Our growing exhibition floor once again has a record-breaking number of exhibitors with an added group of exciting new companies. And dedicated to continuing education, we are thrilled to present the Exhibits Plus Pass to all industry professionals, which grants full and complimentary access to the entire exhibition, keynote addresses, along with plenary and technical panels and receptions."

Major sponsors exhibiting at DesignCon include Agilent Technologies (Official Sponsor), RAMBUS, Inc., LeCroy Corporation, Tektronix, Inc., BERTScope, Computer Simulation Technology, Sigrity, Inc., ANSOFT Corporation, Molex, MOSAID Technologies, Samtec and REED Electronics Group.

The DesignCon exhibition features leading organizations presenting EDA tools, test and measurement equipment, PCBs and related technologies, semiconductor components and IP, interconnect technologies and more.

Exciting new companies joining the DesignCon exhibition include: Accurel Systems, Anritsu Company, ANSYS, Inc., Appro, Arch Pro Design Automation, Inc., ASSET InterTech, Inc., Bogatin Enterprises, CA Design, Carbon Design Systems, Cascade Microtech, ChipEDA, Chip Estimate, Coretec, Corning Gilbert, Inc., Coverity, DuPont Electronic Technologies, Flomerics, Inc., FuturePlus Systems, Innov-x Systems, Inc., Memcore Inc., Merix Corporation, Mixel, NCI Logic Analyzers, NEL Frequency Controls, Nicomatic, Noise Com, Oak-Mitsui Technologies, Paricon Technologies Corporation, Perfectus Technology, Rosenberger of North America, LLC, San Francisco Circuits, Semiconductor Store/Symmetry Electronics, Simberian, Inc., Solarflare Communications, Inc., Springer Science + Business Media, LLC, Starnet and TES Electronic Solutions.

The DesignCon exhibition also features three Technology Pavilions this year providing attendees with hands-on demonstrations in specific technology areas including semiconductor and IP, PCB and verification.

Also on the floor are the DesignCon Poster Sessions, which will be presented by industry authors during the Exhibition Floor Evening Reception on Tuesday and Wednesday. Poster topics include 3D-packaging technologies, advanced interconnect technologies, system-in-package (SiP) design and wafer-level testing.

The TecPreview theatre takes the stage previewing some of the latest industry advancements using multimedia. Presenters include BERTScope, CA Design, eASIC, FuturePlus Systems, LeCroy Corporation, NEL Frequency Controls, Inc., Samtec, Synplicity, Inc. and Tektronix, Inc. More information on TecPreviews can be found at www.designcon.com/2007/exhibition/tecpreviews.html

The annual DesignTOUR also takes place at the show adding another exciting element. High-tech prizes fitting the theme of DesignCon will be given away to attendees from DesignCon sponsors such as Agilent Technologies, BERTScope, LeCroy Corporation, Molex, MOSAID Technologies, Rambus, Inc., Samtec and Tektronix, Inc.

Also on this year's DesignCon exhibition floor will be the newly-announced DesignVision award winners recognizing the most successful design tools released in 2006. Many of the industry's best innovators in electronic design will share their latest developments with attendees.

Industry professionals can preview these and many other hot technologies in the Exhibitor Product Guide available at www.designcon.com/2007/exhibition/exh_product_guide.html.

DesignCon's full exhibitor listing is available at: www.designcon.com/2007/exhibition/exh_list.html.

For complete information, visit www.designcon.com/2007/ or contact Lisa Reyes at lreyes@iec.org or +1-312-559-3325.

Contact:

The International Engineering Consortium
Lisa Reyes, +1-312-559-3325
Email Contact
http://www.iec.org




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