ULCOAT Chosen As Potential Mold Supplier

MUNICH, Germany—(BUSINESS WIRE)—Sept. 11, 2006— SUSS MicroTec (FWB: SMH)(GER: SMH), a leading equipment supplier for the semiconductor industry today announced that the first potential commercial source for C4NP glass molds has been selected. During Semicon Taiwan, SUSS explained that the Glass MEMS Division of ULVAC COATING CORPORATION (ULCOAT) of Saitama, Japan has successfully demonstrated trial production of the reusable glass molds needed to bump wafers using IBM's C4NP process. "The availability of a commercial source for high quality glass molds is one of the critical aspects of this new bumping technology" states Dr. Emmett Hughlett, VP and Business Manager for C4NP at SUSS MicroTec. "We are extremely pleased to have ULCOAT on board and they have exceeded our expectations from day one".

C4NP stands for Controlled Collapse Chip Connection - New Process and is the next generation of wafer bumping technology developed by IBM. Pioneered by IBM, C4NP is a breakthrough in wafer solder bump technology, a semiconductor packaging technique that places pre-patterned solder balls onto the surface of a chip. These bumps ultimately carry data from individual chips to the rest of a computing system. C4NP is a simple and cost-effective alternative to the expensive and difficult electroplating process. Bulk solder is injection molded into re-useable glass molds which carry etched cavities according to the desired bump pattern on the wafer. The mold cavities are filled with pure molten solder which is subsequently transferred onto an entire wafer in one single step. This eliminates the need for electroplating of solder, enabling the use of any alloy including high performance lead-free solders - a critical need to fully enforce RoHS and to eliminate the use of lead in electronic products completely.

About SUSS MicroTec

SUSS MicroTec is a leading supplier of production, process and test technology for the semiconductor industry. SUSS maintains its leadership position with over 7,000 systems installed worldwide. SUSS products include coating developing systems, 1X full-field lithography (1XFFL) systems, wafer bonders, flip-chip bonders, probe systems and now equipment for C4NP production. Headquartered in Munich, Germany, SUSS has 5 international manufacturing sites and provides support from sales and service centers in North America, Europe, Asia and Japan. For more information about SUSS MicroTec, please visit www.suss.com.

All statements in this release other than historical facts are forward-looking statements within the meaning of U.S. Private Securities Litigation Reform Act of 1995. Words such as "believe", "expect", "intend", "anticipate", "estimate", "should", "may", "will", "plan" and similar words and terms used in relation to the enterprise are meant to indicate forward-looking statements of this kind. The company accepts no obligation toward the general public to update or correct forward-looking statements. All forward-looking statements are subject to various risks and uncertainties, as a result of which actual events may diverge numerically from expectations. The forward-looking statements reflect the view at the time they were made.



Contact:
SUSS MicroTec
Fiona Kemp, +49 (0)89 32007 395

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