C4NP stands for Controlled Collapse Chip Connection - New Process and is the next generation of wafer bumping technology developed by IBM. Pioneered by IBM, C4NP is a breakthrough in wafer solder bump technology, a semiconductor packaging technique that places pre-patterned solder balls onto the surface of a chip. These bumps ultimately carry data from individual chips to the rest of a computing system. C4NP is a simple and cost-effective alternative to the expensive and difficult electroplating process. Bulk solder is injection molded into re-useable glass molds which carry etched cavities according to the desired bump pattern on the wafer. The mold cavities are filled with pure molten solder which is subsequently transferred onto an entire wafer in one single step. This eliminates the need for electroplating of solder, enabling the use of any alloy including high performance lead-free solders - a critical need to fully enforce RoHS and to eliminate the use of lead in electronic products completely.
About SUSS MicroTec
SUSS MicroTec is a leading supplier of production, process and test technology for the semiconductor industry. SUSS maintains its leadership position with over 7,000 systems installed worldwide. SUSS products include coating developing systems, 1X full-field lithography (1XFFL) systems, wafer bonders, flip-chip bonders, probe systems and now equipment for C4NP production. Headquartered in Munich, Germany, SUSS has 5 international manufacturing sites and provides support from sales and service centers in North America, Europe, Asia and Japan. For more information about SUSS MicroTec, please visit www.suss.com.
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SUSS MicroTec Fiona Kemp, +49 (0)89 32007 395 Email Contact