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Aprio and Ponte to Collaborate on Lithography-Aware Yield Analysis
Limited Space Still Available in 43rd Design Automation Conference Full-Day Tutorials
Sonics and Summit Design Team to Accelerate Industrywide SystemC Platform SoC Transformation
Mentor Graphics CEO to Moderate Panel at the Design Automation Conference
Celoxica Adds Floating-Point Toolkit to IP Portfolio; Cores Optimized for FPGA-Based Digital Signal Processing & High-Performance Computing Applications
Synopsys Galaxy Platform Reduces Power Consumption of Industry-Leading Multi- Voltage Designs
Synopsys Delivers First 65-nm Reference Flow for IBM, Samsung and CharteredM
Synplicity Signs OEM Agreement with EVE
TSMC Continues Industry Leadership with Reference Flow 7.0
LogicVision to Demonstrate 6.2Gbps High Speed SerDes Test Solution at 43rd Design Automation Conference
CoFluent Studio To Accelerate Exploration Of Digital Multimedia SoC Architectures Based On Sonics® SMART Interconnects
Aprio Establishes Direct Operations in Japan
Magma's Quartz DRC Physical Verification Now Qualified on UMC's 90-nm Process Technology Nodes
Silistix Self-Timed Interconnect Solution Adds Support for AXI Bus Protocol
Sierra Design Automation Delivers Olympus-SoC -- Industry's Premier Lithography Driven IC Implementation System for 65nm/45nm Designs
Turn on and tune into Pulsic at DAC 2006
FSA Introduces Mixed-Signal/RF PDK Checklist Version 2.0
Market Rapidly Embraces Tensilica's Diamond Standard Processor Cores in 2006
Open SystemC Initiative Ensures Global Access of IEEE Std. 1666(TM)-2005 Language Reference Manual at No Cost to Users
True Circuits Attends Design Automation Conference, Features Complete Line of PLL and DLL Intellectual Property for ASIC, FPGA and SoC Designs
Elsevier New Textbook serves as Comprehensive Guide for Latest, Up-to-Date Technologies of Design-for-Testability
Novas to Showcase Award-Winning Siloti Visibility Enhancement and Verdi Debug Products at DAC 2006
43rd Design Automation Conference Offers Free Monday on July 24
Mentor Graphics Presents The MythBusters at the Design Automation Conference
Mentor DFT Tools Fully Support TSMC's Reference Flow 7.0
TSMC Reference Flow 7.0 Incorporates Synopsys' IC Compiler
Industry Momentum Builds for the ARM-Synopsys VMM for SystemVerilog
Altera Announces First AQEC-Compliant FPGAs
Cadence and TSMC Accelerate 65-Nanometer Design With TSMC Reference Flow 7.0
Summit Design's Award Winning Vista IDE Enhances Its SystemC Debugging Capabilities With IEEE 1666 and Windows Platform Support
Magma Announces Integrated Characterization-to-Silicon DFM Flow Targeting 65-nm Designs
Greg Spirakis Joins ArchPro Board
Blaze DFM Solution Proven in Silicon on Mobile Baseband Processor
MEDIA ALERT -- VSIA Presents Panel on IP Integration at DAC 2006 in San Francisco
CebaTech Announces Strategy to Deliver High-Value Internet Protocol Intellectual Property and Breakthrough ESL Technology
BiTMICRO(R) Networks Signs Corporate Agreement for Kilopass 90-Nanometer XPM Memory Technology
Virtutech Announces Free Academic License for Simics
Berkeley Design Automation Secures Strategic Investment by Matsushita Electric Industrial Co., Ltd.
Novas Siloti Visibility Enhancement Solutions Win Product of the Year Award from Electronique Magazine
VaST Systems Announces 1-SOURCE Initiative
AWR and Helic Partner to Offer VeloceRF Technology in Analog Office Software
Arteris and CoWare Announce Integration of Arteris Network on Chip (NoC) Technology Into CoWare Platform Architect ESL Design Environment
Incentia TimeCraft Adopted by NEC Electronics' EMMA(TM) Project Team for Design Tape-Outs
VaST's Latest CoMET6 Delivers Breakthroughs in Performance, Interoperability, and Power
Liga Systems Unveils Breakthrough Hybrid Simulator That Boosts Traditional RTL Simulation by 10 to 100 Times
Sierra Design Automation, in Collaboration With Mentor Graphics, Enables Lithography-Driven Closure for 65nm/45nm Designs
MoSys to Announce Second Quarter 2006 Financial Results
Other IP & SoC News
Fujitsu to Provide Industry's First Comprehensive Environment for Statistical Timing Analysis for Submicron Designs
STMicroelectronics Uncovers Latest in Design Methodologies and Challenges at DAC 2006
Centillium Completes New Ultra-High-Speed, Long-Reach VDSL2 Chipset Using Magma Software
PLD Applications and Rapid Bridge Systems Announce Partnership
Dongbu Electronics Expands Analog IP Portfolio to Support Development of Advanced Chips for Mobile Applications With Chipidea
Cypress Reports Second Quarter 2006 Results
Fairchild Semiconductor Reports Results for the Second Quarter 2006
CEVA Inc. Reports Second Quarter 2006 Financial Results
STMicroelectronics Delivers New Generation of 'Near Zero Power' Disk Drive Preamplifiers for Sub-2.5" Drives in Portable Products
PLDA and ChipX Announce Collaboration--PCI Express IP Integrated in Structured ASIC to Offer Complete PCIe Solution
EUs SPEEDS initiative targets global leadership in embedded systems design
Atmel Introduces a Low Cost USB OTG Development Platform
Infineon to Enter Ultra-Wideband Market With Industry's First Dual-Band RF-CMOS Transceiver Core, Paving the Way for the Converged Entertainment Cell Phone
Cypress Ships First Devices Made by China Foundry Partner, Grace Semiconductor, Several Months Ahead of Plan
Rambus Expects Financial Restatement Related to Stock-Based Compensation
Microcontrollers Market Penetrating Industrial and Automotive Industries
ARM Releases Next-Generation DDR Memory Solutions to Improve Chip Performance
New Dual-Core Intel(R) Itanium(R) 2 Processor Doubles Performance, Reduces Power Consumption
SigmaTel Announces New Sales and Marketing Executive
Lexar Increases Performance of High-Capacity CompactFlash to 133X
OSRAM Opto Semiconductors and Lighting Science Group to Collaborate on New High-Tech Lamps
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