Honeywell Announces New Thermal Management Material For Semiconductor Manufacturing
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Honeywell Announces New Thermal Management Material For Semiconductor Manufacturing

Screen Printable Phase Change Materials Provide Greater Flexibility

TEMPE, Ariz., March 16 /PRNewswire/ -- Honeywell (NYSE: HON) Electronic Materials today announced the release of a new screen printable phase change material developed to provide semiconductor chip manufacturers with flexibility in meeting the challenge of thermal management.

This new product, designated as Honeywell PCM45F-SP thermal interface material, allows manufacturers to apply phase change materials in a variety of different shapes depending on the shape of the chip design, also known as the screen print of the chip. Until now, manufacturers have been limited by the shape of phase change materials supplied in traditional tape formats.

"This new material meets significant industry challenges while providing flexibility so that our customers can optimize its use during the semiconductor packaging process," said Dmitry Shashkov, metals business segment leader for Honeywell Electronic Materials. "Our materials development programs are driven by listening to our customers and then offering new materials that provide them with value."

Honeywell introduced the material at the Semiconductor Thermal Measurement, Modeling and Management Symposium and Exposition, which was held March 12-16 in Dallas, Texas.

Thermal management has become a critical issue for the semiconductor industry as manufacturers seek to dissipate the tremendous heat generated by today's high-powered chips. If this heat is not dissipated, it shortens the life of computer chips and may cause them to cease functioning altogether. Honeywell helps chip manufacturers solve thermal management problems with materials that either conduct heat away from the chip to some other area or provide a means by which heat can be dissipated into the surrounding air.

Phase change materials are heat conductors which change phase from a solid, to a semi-solid or liquid state. This phase change allows these materials to fill the micro-gaps between the chip and the material, thereby providing a more effective and efficient means to transfer the heat away.

Traditionally, such phase change materials have only been available in a tape format, with the materials supplied on a roll. Small pads of the material are then affixed to the desired area during the semiconductor packaging process. The new screen printable format allows manufacturers to apply the material in a wide variety of different shapes, depending upon the screen print design used by the manufacturer to layout the design of the semiconductor chip.

Honeywell Electronic Materials, a part of Honeywell Specialty Materials, is a leading material supplier to the semiconductor industry developing and manufacturing a broad line of products utilized in the production of integrated circuits. Providing solutions for applications utilizing subtractive or damascene processes, Honeywell offers spin-on glasses, advanced dielectrics, application specific electronic chemicals, PVD targets, thermocouples and packaging solutions for thermal management and electrical interconnect as well as sapphire substrates and custom sapphire fabrications for the optoelectronics industry.

Honeywell International is a $28 billion diversified technology and manufacturing leader, serving customers worldwide with aerospace products and services; control technologies for buildings, homes and industry; automotive products; turbochargers; and specialty materials. Based in Morris Township, N.J., Honeywell's shares are traded on the New York, London, Chicago and Pacific Stock Exchanges. It is one of the 30 stocks that make up the Dow Jones Industrial Average and is also a component of the Standard & Poor's 500 Index. For additional information, please visit

Honeywell Specialty Materials, based in Morristown, N.J., is a global leader in providing customers with high-performance specialty materials, including fluorine products; specialty films and additives; advanced fibers and composites; intermediates; specialty chemicals; electronic materials and chemicals; and technologies and materials for petroleum refining.

This report contains "forward-looking statements" within the meaning of Section 21E of the Securities Exchange Act of 1934. All statements, other than statements of fact, that address activities, events or developments that we or our management intend, expect, project, believe or anticipate will or may occur in the future are forward-looking statements. Forward-looking statements are based on management's assumptions and assessments in light of past experience and trends, current conditions, expected future developments and other relevant factors. They are not guarantees of future performance, and actual results, developments and business decisions may differ from those envisaged by our forward-looking statements. Our forward-looking statements are also subject to risks and uncertainties, which can affect our performance in both the near- and long-term. We identify the principal risks and uncertainties that affect our performance in our Form 10-K and other filings with the Securities and Exchange Commission.

CONTACT: Peter Dalpe of Honeywell Specialty Materials, +1-973-455-4908,
Email Contact, or Lance Chapman of Honeywell Electronic
Materials, +1-408-962-2098, Email Contact

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