Applied Materials Announces Advanced CVD Aluminum Technology For Faster Flash And DRAM Chips

SANTA CLARA, Calif.—(BUSINESS WIRE)—Dec. 6, 2005— Applied Materials, Inc. today announced its Applied CVD Al(1) process chamber for building current and next-generation high-density interconnects in Flash and DRAM memory chips. Using aluminum deposition technology, which continues to be the interconnect material of choice for memory applications, Applied's CVD Al chamber enables chipmakers to replace tungsten plugs with aluminum -- which has 50% lower electrical resistance -- while also reducing processing steps and cost.

"As leading DRAM and flash memory chipmakers move to sub-90nm chip generations, our CVD Al technology enables faster chips than conventional tungsten plug-aluminum slab technology and extends cost-effective aluminum interconnects for several more device generations," said Dr. Farhad Moghadam, senior vice president and general manager of Applied Materials' Thin Films Group. "Rapid acceptance by customers during the evaluation of our CVD Al technology has resulted in the shipment of multiple chambers, many of which are being used in today's high volume 90nm manufacturing."

The Applied Endura(R) CVD Al process deposits a thin, highly conformal metal nucleation layer with excellent step coverage in the chip's via structure. Combined with PVD aluminum fill technology on the high-productivity Endura platform, the CVD Al chamber enables unmatched via fill at low thermal budget for improved yield and device reliability.

Applied Materials' CVD aluminum technology enables customers to meet the accelerating demand for Flash memory chips, the fastest-growing segment of the semiconductor industry, by providing the low cost, high-efficiency and extendibility that can be quickly implemented into current production ramps. Capable of meeting flash requirements to at least the 50nm generation, Applied's CVD Al provides chipmakers with greater flexibility in choosing the timing of their future interconnect technologies, allowing simpler and faster node transitions than copper, without the need for additional process technologies.

Applied Materials, Inc. (Nasdaq: AMAT), headquartered in Santa Clara, California, is the largest supplier of equipment and services to the global semiconductor industry. Applied Materials' web site is www.appliedmaterials.com



(1) CVD = chemical vapor deposition Al = aluminum




Contact:
Applied Materials, Inc.
Betty Newboe, 408-563-0647 (editorial/media)
Paul Bowman, 408-563-1698 (financial community)



Review Article Be the first to review this article
Rand3D

SolidCAM: SolidCARE

Featured Video
MCAD Corporate Newsletter
rss feed
Editorial
Jeff RoweJeff's MCAD Blogging
by Jeff Rowe
NVIDIA’s AI Computer Drives AVs
Jobs
Senior Mechanical Engineer for Albert Kahn and Associates at Detroit, MI
Mechanical Engineer for The Planate Management Group LLC at Perry Point, MD
GIS Analyst for G2 Partners LLC at San Ramon, CA
Structural Engineer for Albert Kahn and Associates at Detroit, MI
GIS Software Developer for UDC at Englewood, CO
Vice President, Transportation Services for Associated General Contractors of New York State at Albany, NY
Upcoming Events
ASSESS 2017 CONGRESS at Bolger Center Potomac MD - Nov 1 - 3, 2017
FABTECH 2017 at McCormick Place Chicago IL - Nov 6 - 9, 2017
ATX MINNEAPOLIS 2017 at Minneapolis MN - Nov 8 - 9, 2017
2017 China Chongqing International Machine Tool Show (CCIMT) at Chongqing International Expo Center, Yubei Chongqing China - Nov 13 - 16, 2017



Internet Business Systems © 2017 Internet Business Systems, Inc.
25 North 14th Steet, Suite 710, San Jose, CA 95112
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation GISCafe - Geographical Information Services TechJobsCafe - Technical Jobs and Resumes ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise