Nano Dimension Files Patent for Proprietary Copper Ink

Material used to print electronic conductors

NESS ZIONA, Israel, Nov. 30, 2015 — (PRNewswire) — Nano Dimension, a leading printing electronics company in the area of 3D printing (TASE: NNDM, OTCQX: NNDMY), announced today that Nano Dimension Technologies, a fully owned subsidiary of Nano Dimension, has filed a patent application with the U.S. Patent and Trademark Office for a proprietary copper ink that is used in the printing of electronic conductors.

The copper nanoparticle-based ink provides improved oxidation resistance, resulting in an innovative breakthrough that offers the ability to print copper with industrial 3D digital printers.

Copper is a highly electrically conductive metal, and its low price gives it a significant advantage in the market when compared to silver. However, copper nanoparticles rapidly oxidize upon contact with air, which impairs the electrical conductivity.

The patent application that the Company has filed presents innovative approaches to overcome the problem of copper nanoparticle oxidation. Overcoming this challenge introduces an effective and less costly method for industrial additive manufacturing of printed electronics by 3D printing.

Amit Dror, CEO of Nano Dimension, commented: "Our conversations with hundreds of companies across different industrial sectors indicate a strong demand for our 3D printed electronics technology. The demand is not limited to prototyping, but also includes industrial scale manufacturing applications.

The current global PCB market is estimated to be larger than USD 70 billion and is expected to reach about USD 100 billion in the coming years. In accordance with our vision that innovative materials are key to advancing additive manufacturing, Nano Dimension engages in research and development to widen the use-cases of its innovative 3D printed electronics technology. A high-performance copper nanoparticle ink presents an opportunity to significantly impact this huge market."

About Nano Dimension
Nano Dimension, founded in 2012, focuses on development of advanced 3D printed electronics systems. Nano Dimension's unique products combine three advanced technologies: 3D inkjet, 3D software and nanomaterials. The company's primary products include the first 3D printer dedicated to printing multi-layer PCBs (printed circuit boards) and advanced nanotechnology-based conductive and dielectric inks.

Nano Dimension trades on OTCQX® Best Market in the U.S. and on the TASE in Israel. The Bank of New York Mellon serves as the depositary for Nano Dimension. U.S. investors can find current financial disclosure and Real-Time Level 2 quotes for Nano Dimension on

This press release contains forward-looking statements. Words such as "expects," "anticipates," "intends," "plans," "believes," "seeks," "estimates" and similar expressions or variations of such words are intended to identify forward-looking statements. These statements are only predictions based on Nano Dimension's current expectations and projections about future events.

There are important factors that could cause Nano' Dimension's actual results, level of activity, performance or achievements to differ materially from the results, level of activity, performance or achievements expressed or implied by the forward-looking statements.

Those factors include, but are not limited to the impact of general economic conditions, competitive products, product development risk, product demand and market acceptance risks, reliance on key strategic alliances or fluctuations in operating results. Except as otherwise required by law, Nano Dimension undertakes no obligation to publicly release any revisions to these forward-looking statements to reflect events or circumstances after the date hereof or to reflect the occurrence of unanticipated events.


To view the original version on PR Newswire, visit:

SOURCE Nano Dimension

Nano Dimension
INVESTOR RELATIONS: Miri Segal-Scharia, Hayden/ MS-IR LLC, 917-607-8654
Email Contact

Review Article Be the first to review this article
Autodesk - DelCAM

Featured Video
Jeff RoweJeff's MCAD Blogging
by Jeff Rowe
Apple Adding To Computer Product Line Minus Ports
Currently No Featured Jobs
Upcoming Events
Electric&Hybrid Aerospace Technology Symposium 2016 at Conference Centre East. Koelnmesse (East Entrance) Messeplatz 1 Cologne Germany - Nov 9 - 10, 2016
Autodesk University Las Vegas at Las Vegas NV - Nov 15 - 17, 2016
Design & Manufacturing, Feb 7 - 9, 2017 Anaheim Convention Center, Anaheim, CA at Anaheim Convention Center Anaheim CA - Feb 7 - 9, 2017
Colortrac: LearnMore
TurboCAD pro : Free Trial

Internet Business Systems © 2016 Internet Business Systems, Inc.
595 Millich Dr., Suite 216, Campbell, CA 95008
+1 (408)-337-6870 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation GISCafe - Geographical Information Services TechJobsCafe - Technical Jobs and Resumes ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy Policy Advertise