Mentor Graphics Works with Tezzaron and MOSIS on 3D-IC Prototyping Service

WILSONVILLE, Ore. — (BUSINESS WIRE) — June 3, 2011Mentor Graphics Corporation (NASDAQ: MENT) today announced a cooperative effort with Tezzaron Semiconductor and MOSIS to provide IC designers with a way to economically develop and manufacture 3D-IC prototypes on multi-project wafers (MPWs). The process enables designs using tens of millions of through silicon vias (TSVs) with dimensions as small as 1.2 x 6 microns and a pitch of 2.4 microns, producing up to 300,000 vertical interconnects per square millimeter.

“Our collaboration allows firms to explore practical applications of true 3D-IC integration in a way that reduces risk and cost, while taking advantage of over a decade of experience in manufacturing 3D-ICs with high density TSVs,” said Robert Patti, CTO of Tezzaron Semiconductor.

“Adding Tezzaron’s offering to our Multi Project Wafer (MPW) services allows companies to test out 3D-IC concepts using the same provider and model they currently use for their standard semiconductors,” said Wes Hansford, director at MOSIS. “By coordinating resources and schedules, we can significantly reduce the effort and risk involved in getting the silicon-proven data required to make effective product roadmap decisions.”

“We’re working with Tezzaron and MOSIS to ensure that even at the prototype stage our customers will be able to access production-certified Calibre solutions to verify that their 3D-IC designs are manufacturable,” said Joseph Sawicki, vice president and general manager of the Design-to-Silicon Division at Mentor Graphics. “The Calibre solution uses foundry-certified PDKs from MOSIS wafer suppliers with extensions for MOSIS-Tezzaron 3D-IC designs.”

Customers can use the 3D-IC service to create proof-of-concept ICs that demonstrate the use of high-density TSVs in stacked die configurations for intelligent sensor, multi-core processor and many other applications. MOSIS manages MPW projects including reticle creation, fab reservations, final packaging and testing, and other logistics. Tezzaron enhances customer designs as required for successful 3D-IC integration and also provides backend manufacturing steps including wafer thinning, backside metal and wafer bonding. Mentor provides DRC and LVS tools that support 3D-IC physical verification, ensuring that designs are correct and will meet 3D process requirements.

For more information about the 3D-IC prototyping service, please go to the MOSIS web site at

About Tezzaron

Tezzaron® Semiconductor specializes in 3D wafer stacking, TSV processes, and cutting-edge memory products. In 2004, Tezzaron demonstrated the world’s first successful 3D-ICs with TSV, including microprocessors, sensors, and SRAM devices. Tezzaron was founded in 1999 and maintains its headquarters at 1415 Bond Street, Suite 111, Naperville, IL 60563 (


MOSIS is a low-cost prototyping and small-volume production service for VLSI circuit development. Since 1981, MOSIS has fabricated more than 50,000 circuit designs for commercial firms, government agencies, and research and educational institutions around the world.

About Mentor Graphics

Mentor Graphics Corporation (NASDAQ: MENT) is a world leader in electronic hardware and software design solutions, providing products, consulting services and award-winning support for the world’s most successful electronic, semiconductor and systems companies. Established in 1981, the company reported revenues over the last 12 months of about $915 million. Corporate headquarters are located at 8005 S.W. Boeckman Road, Wilsonville, Oregon 97070-7777. World Wide Web site:

(Mentor Graphics and Calibre are registered trademarks of Mentor Graphics Corporation. All other company or product names are the registered trademarks or trademarks of their respective owners.)


Mentor Graphics
Gene Forte, 503-685-1193
Email Contact
Sonia Harrison, 503-685-1165
Email Contact

Review Article Be the first to review this article
SolidCAM: Program your CNCs directly inside your existing CAD system.

Autodesk - DelCAM

Featured Video
Jeff RoweJeff's MCAD Blogging
by Jeff Rowe
Apple Adding To Computer Product Line Minus Ports
GIS Analyst for City of Elk Grove at Elk Grove, CA
Upcoming Events
Electric&Hybrid Aerospace Technology Symposium 2016 at Conference Centre East. Koelnmesse (East Entrance) Messeplatz 1 Cologne Germany - Nov 9 - 10, 2016
Autodesk University Las Vegas at Las Vegas NV - Nov 15 - 17, 2016
TurboCAD pro : Free Trial

Internet Business Systems © 2016 Internet Business Systems, Inc.
595 Millich Dr., Suite 216, Campbell, CA 95008
+1 (408)-337-6870 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation GISCafe - Geographical Information Services TechJobsCafe - Technical Jobs and Resumes ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy Policy Advertise