SMSC's Inter-Chip Connectivity Technology Licensed by Leading Company

HAUPPAUGE, N.Y., Feb 15, 2011 (BUSINESS WIRE) - SMSC (NASDAQ: SMSC), a leading semiconductor company creating valued connectivity ecosystems, announced today that Qualcomm Incorporated has licensed SMSC's patented Inter-Chip Connectivity(TM) (ICC) technology.

ICC enables the USB 2.0 protocol, which is now standard in billions of electronic devices, to be delivered over short distances consuming a fraction of the power of a traditional USB 2.0 analog interface while retaining most of the software compatibility with an analog USB 2.0 connection. The High Speed Interconnect (HSIC) specification (an addendum to the USB 2.0 specification) includes the ICC technology. Where applicable, such as in portable applications, the ICC technology decreases power consumption and silicon area compared to an analog USB 2.0 interface.

Using its ICC license with SMSC, Qualcomm can develop devices that are compliant with the HSIC specification for both USB 2.0 host and USB 2.0 device applications.

About SMSC's ICC Technology

SMSC's ICC technology is described in U.S. Patent No. 7,702,832, which was issued to SMSC on April 20, 2010. Additional related patent applications have been filed by SMSC in the United States and other countries. As provided for in the appropriate agreements, USB 2.0 promoters and companies that have timely signed both the USB 2.0 Adopters Agreement and a related HSIC amendment letter may license SMSC's ICC technology patents under reasonable and non-discriminatory (RAND) terms. Further, SMSC's ICC technology is now available to the industry at large through individually negotiated patent licenses from SMSC. For information about licensing SMSC's patented ICC technology, please visit www.smsc.com/icc.

About SMSC

SMSC is a leading developer of Smart Mixed-Signal Connectivity(TM) solutions. SMSC employs a unique systems level approach that incorporates a broad set of technologies and intellectual property to deliver differentiating products to its customers. The company is focused on delivering connectivity solutions that enable the proliferation of data in personal computers, automobiles, portable consumer devices and other applications. SMSC's feature-rich products drive a number of industry standards and include USB, MOST(R) automotive networking, Kleer(R) wireless audio, embedded system control and analog solutions, including thermal management and RightTouch(TM) capacitive sensing. SMSC is headquartered in New York and has offices and research facilities in North America, Asia, Europe and India. Additional information is available at www.smsc.com.



Contacts:

Carolynne Borders,
SMSC
Senior Director of Corporate Communications & Investor Relations
631-435-6626
carolynne.borders@smsc.com

Tarah Hartzler,
McClenahan Bruer Communications
Public Relations
503-546-1014
tarah@mcbru.com




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