SEMATECH to Highlight Leading-Edge Research in Technology and Manufacturing at SEMICON West 2010
Presentations and Public Workshops Feature 3D Interconnects, Advanced
Materials, and Manufacturing Methods
AUSTIN, Texas & ALBANY, N.Y. — (BUSINESS WIRE) — June 21, 2010 —
SEMATECH and International SEMATECH Manufacturing Initiative (ISMI) will
highlight current research through a wide range of lectures and workshop
sessions from July 13-15, in conjunction with SEMICON West 2010 in San
SEMATECH and ISMI experts will report their latest advances in new
materials and device structures, next-generation metrology, and
equipment and fab productivity, with a special focus on addressing key
opportunities and challenges in 3D interconnect technology.
“Our goal is to promote innovative and practical solutions for continued
scaling of semiconductor technologies that can easily be incorporated
into real-world manufacturing environments,” said Dan Armbrust,
president and CEO of SEMATECH. “Through various presentations and
workshops we look forward to sharing our technical knowledge and best
practices, exploring the promise of 3D interconnects, and introducing
new manufacturing concepts to help drive our industry forward.”
Several SEMATECH and ISMI experts are scheduled to speak on the SEMICON
West TechXPOT Stage, in the North Hall of Moscone Center, on July 14,
Paul Kirsch, SEMATECH’s director of Front End Processes, “Metal
Oxide RRAM as a Future Non-Volatile Memory Technology,” at 11 a.m.
Dilip Patel, ISMI’s Metrology program manager, “Measuring the
Nanoscale: Metrology Challenges in Manufacturing,” at 12:20 p.m.
Bryan Rice, SEMATECH’s director of Lithography, will
moderate the Advanced Lithography TechXPOT session from 2 – 4:30 p.m.
Additionally, SEMATECH and ISMI will host various public workshops
during SEMICON West:
Equipment suppliers and end users will meet to address the issue of
overspecification of utility capacity for semiconductor process tools
at the ISMI Equipment Energy Workshop - Overspecification
on July 12 at 8 a.m., at the Marriott Marquis.
ISMI’s Cluster Tool Performance Tracking Workshop will provide
insight and training on an innovative methodology developed by ISMI to
determine the performance metrics of multi-path cluster tools. The
workshop will also offer equipment performance benchmarking solutions
on July 12 at 1 p.m. in the Club Room, at the Marriott Marquis.
Equipment suppliers will discuss the viability of a standard
communications interface protocol between the main tool and support
equipment such as roughing vacuum pumps and point of use abatement
devices at the ISMI Equipment Energy Workshop – Standardized
Communication Protocol for Idle Mode on July 12 at 1 p.m., at the
Hosted by SEMATECH, in collaboration with Fraunhofer IZFP, the second
workshop on Stress Management for 3D ICs using Through Silicon Vias
will discuss DFM-like approaches for managing stress, including
required material properties, measurement techniques and corresponding
simulation use modes on July 13 at 9 a.m., at the Grand Hyatt.
As a part of the ISMI Installed-base Equipment Series, ISMI
will host the following workshops at the Marriott Marquis:
OEM-focused Dry Etch Process Equipment Workshop, on July 13 at
Equipment Productivity Workshop on Dry Etch Chambers, on July 14
at 8:00 a.m.
OEM-focused Dry Etch Process Equipment Workshop, on July 15 at
Co-sponsored by SEMI and SEMATECH, the 3D Interconnect Challenges
and Need for Standards Workshop will provide the vision and
progress to date on 3D TSV integration, solicit areas of concern, and
identify the areas of variance between existing solutions and
proposed/anticipated solutions on July 13 at 1:00 p.m., at the
Equipment suppliers will share their plans on how new and existing
wafer metrology technologies can be used, modified, or enhanced to
measure and improve 3D interconnect processes at SEMATECH's 3D
Metrology Workshop on July 14 at 1:00 p.m., at the Marriott
Co-organized with SEMI, ISMI’s e-Manufacturing Workshop will
focus on the Equipment Data Acquisition interface (Interface A).
e-Manufacturing enabling implementation strategies on the Interface A
requirements, including the next freeze level, will be presented to an
audience of chip-makers, equipment companies and software suppliers on
July 14 at 1:00 p.m., at the Marriott Marquis.
Co-organized with SEMI, ISMI’s Product and Equipment Time Metrics
Workshop will provide a forum to introduce the concept of “Product
and Equipment Time Metrics” to the semiconductor industry.
Participants will gain an understanding of the definition and use of
the time metrics concepts as an alternative method for identifying,
measuring, and improving factory and equipment productivity on July 15
at 1 p.m., at the Marriott Marquis.