STMicroelectronics Unveils Latest Advances in Design Methodologies at DAC 2009

DAC 2009 - July 26-31, 2009, Moscone Center, San Francisco, California

GENEVA, July 24 /PRNewswire-FirstCall/ -- STMicroelectronics (NYSE: STM), one of the world's most innovative semiconductor companies, will participate as presenter or co-author of several papers at the DAC 2009 (Design Automation Conference), which takes place from July 26-31, 2009, in San Francisco, California. ST's contributions to the conference cover advances in design methodologies and automation in the areas of 3-D stacking for complex SoC (System-on-Chip) ICs, physical- and system-level chip design, and IC reliability.

In the DAC 2009 'Management Day' session, Philippe Magarshack, STMicroelectronics' General Manager of Central CAD & Design Solutions will present: '3-D Stacking: Opportunities and Trends for Consumer SoCs', which will discuss 3-D integration as a promising technology to extend the momentum of Moore's Law into the next decade, offering higher transistor density, faster interconnects, heterogeneous technology integration, with potentially lower power, cost and faster time-to-market. However, 3-D integration isn't without challenges: the presentation discusses the need for a range of new capabilities including process technology, architectures, design methods and tools, and manufacturing-worthy test solutions to be developed before 3-D chips can be mass produced for consumer applications.

Also, as part of the Management Day, Magarshack will participate on the panel 'Making Critical Decisions for Emerging SoC Development,' which will discuss emerging solutions for complex nanometer SoCs and their economic impact.

ST is also presenting several papers in physical and system-level design, including the examination of architectural-level design and power-estimation techniques, and the design-automation of IP re-use.

The need to design differentiated SoC product derivatives in extremely narrow time windows is tackled by a paper from ST engineers. The paper describes the moving of design creation to higher levels of abstraction, presenting an ESL (Electronic System Level) design methodology as a solution to deal with the increasing design challenges in the industry. In addition, the paper explores solutions for optimal designs in terms of power performance and silicon die area.

Another paper describes how ST engineers have used the SPIRIT (Structure for Packaging, Integrating and Re-using IP within Tool flows) Consortium's IP-XACT standards to enable IP reuse through design automation, to provide an SoC integration solution for ST's program (with Freescale) for the fast development of new 32-bit automotive microcontroller families.

An approach to improving design productivity for digital consumer ICs is the subject of another paper. ST's engineers propose allowing front-end designers to prototype the SoC at the architecture level, gaining early insight into potential implementation issues during the design capture stage.

Power management, also, is an increasingly important concern for both wireless and wired applications. ST engineers will present an architectural-level power planning and estimation system to manage the challenges to preserve power and extend battery life in portable products.

Testing and reliability are also addressed by ST's engineers, in two papers. The first paper is a presentation on a low-power DFT (Design-For-Test) flow for multi-voltage designs and ATPG (Automatic Test Pattern Generation). The second paper examines an approach for the reduction of EMI (Electromagnetic Interference) to produce very robust automotive IC designs.

Further information about DAC 2009 and ST's papers is available at: http://www.dac.com/46th/index.aspx

About STMicroelectronics

STMicroelectronics is a global leader serving customers across the spectrum of electronics applications with innovative semiconductor solutions. ST aims to be the undisputed leader in multimedia convergence and power applications leveraging its vast array of technologies, design expertise and combination of intellectual property portfolio, strategic partnerships and manufacturing strength. In 2008, the Company's net revenues were $9.84 billion. Further information on ST can be found at www.st.com.

SOURCE STMicroelectronics

Web site: http://www.st.com/


Reviews:
Review Article
For more discussions, follow this link …
HP

SolidCAM: Program your CNCs directly inside your existing CAD system.

Featured Video
Jobs
CAD Systems Administrator for KLA-Tencor at Milpitas, CA
Principal Research Mechatronics Engineer for Verb Surgical at Mountain View, CA
Senior Mechanical Engineer for Verb Surgical at Mountain View, CA
Industrial Designer Intern – Spring 2017 for Nvidia at Santa Clara, CA
Lead Geospatial Analyst for Alion at McLean, VA
Upcoming Events
SOLIDWORKS 2017 Launch Event – Walsall at Village Hotel Club, Walsall, WS2 8TJ Walsall United Kingdom - Mar 30, 2017
PI APPAREL Hong Kong 2017 at SHANGRI-LA KOWLOON 64 Mody Road Tsim Sha Tsui East Kowloon Hong Kong - Apr 5 - 6, 2017
SOLIDWORKS intro and hands on session – Slough at Baylis House, Slough, Berkshire, SL1 3PB Slough United Kingdom - Apr 7, 2017
Engineer 3D! Training + Technology Conference at Hyatt Regency Milwaukee 333 West Kilbourn Avenue Milwaukee WI - Apr 25 - 26, 2017
MasterCAM



Internet Business Systems © 2017 Internet Business Systems, Inc.
595 Millich Dr., Suite 216, Campbell, CA 95008
+1 (408)-337-6870 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation GISCafe - Geographical Information Services TechJobsCafe - Technical Jobs and Resumes ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy Policy Advertise