By combining the NAND and flash memory controller in one package, Micron’s e∙MMC solutions simplify the application interface design and alleviate the host processor from low-level flash memory management. The e∙MMC 4.4 standard is backward compatible with previous MMC standards.
“As today’s mobile phones grow in content, features and functionality, there is a movement to ensure that the technology within these devices is flexible enough to evolve with the platforms,” said Eric Spanneut, director of mobile memory marketing for Micron. “Micron is introducing products supporting the e∙MMC 4.4 standard to allow our customers and partners to begin designing around a solution that reduces component count and bolsters system security.”
The NAND partitioning feature of the e∙MMC 4.4 standard allows designers to configure partitions of the multi-level cell (MLC) NAND to act as single-level cell (SLC) NAND and securely store and execute handset boot code. Doing this in MLC NAND eliminates the need for an extra SLC chip and reduces the component count, simplifying product integration and freeing up board space.
Also new for the e∙MMC 4.4 standard are heightened security features that restrict access to the phone’s critical software, including the boot code and operating system. Specific security features include power-on write protection, permanent write protection and secure memory block. These features ensure that data is unaltered when transferred and stored, as well as during device re-boot and power down.
“We are impressed with the new e∙MMC 4.4 standard ratified through JEDEC. As today’s mobile devices grow in sophistication and usage, it’s very critical that the managed NAND storage solution deliver improved security features to keep the program data tightly secured. We’re looking to align e∙MMC 4.4 with our future platforms and we look forward to engaging with Micron on their new e∙MMC 4.4 product portfolio,” said David Foster, general manager at Microsoft.
Designed using its industry-leading 34-nanometer NAND technology, Micron’s e∙MMC 4.4 solutions range in density from 2 gigabytes (GB) to 32GB. For additional information on the product portfolio, please visit www.micron.com/products/nand/managed-nand.
Micron Technology, Inc. is one of the world's leading providers of advanced semiconductor solutions. Through its worldwide operations, Micron manufactures and markets DRAM, NAND flash memory, CMOS image sensors, other semiconductor components, and memory modules for use in leading-edge computing, consumer, networking and mobile products. Micron’s common stock is traded on the New York Stock Exchange (NYSE) under the MU symbol. To learn more about Micron Technology, Inc., visit www.micron.com.
Micron and the Micron orbit logo are trademarks of Micron Technology, Inc. eMMC is a trademark of the MultiMediaCard Association. All other trademarks are the property of their respective owners.
This press release contains forward-looking statements regarding the production of e∙MMC 4.4. Actual events or results may differ materially from those contained in the forward-looking statements. Please refer to the documents the Company files on a consolidated basis from time to time with the Securities and Exchange Commission, specifically the Company's most recent Form 10-K and Form 10-Q. These documents contain and identify important factors that could cause the actual results for the Company on a consolidated basis to differ materially from those contained in our forward-looking statements (see Certain Factors). Although we believe that the expectations reflected in the forward-looking statements are reasonable, we cannot guarantee future results, levels of activity, performance or achievements. We are under no duty to update any of the forward-looking statements after the date of this press release to conform to actual results.
Micron Technology, Inc.
Kirstin Bordner, 208-368-5487