BERLIN — May 19, 2009 /PRNewswire-FirstCall/ — CEVA, Inc. (NASDAQ: CEVA); (LSE: CVA), a leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores and Aricent™, a global innovation, technology and services company focused exclusively on communications, announced today that the companies will demonstrate a licensable IP platform for LTE baseband terminals based on a CEVA DSP core at the LTE World Summit 2009, May 18-20 in Berlin, Germany. The platform will showcase a CEVA DSP running several LTE physical layer functions purely in software. The demonstration will be on display at Aricent's expo booth #10 in the main exhibition hall.
CEVA's industry leading DSP cores power many of the world's leading cellular baseband handset solutions through its broad customer base including Infineon, ST-Ericsson, Broadcom, Spreadtrum and VIA Telecom, among others. To date, more than 450 million CEVA-powered handsets have shipped. Addressing next generation LTE terminal and infrastructure markets, the CEVA-X1641 and CEVA-XC DSPs have been specifically architected to overcome the stringent power consumption, time-to-market and cost constraints associated with developing high performance WiMAX, LTE and SDR wireless communications processors. CEVA has multiple licensees today developing LTE handset and infrastructure solutions based on CEVA DSP cores.
"Aricent's leadership in LTE technology innovation made them a clear choice for LTE frameworks as we expand the 3rd party software offerings for our 4G wireless communications DSPs," said Eyal Ben-Avraham, vice president, Partners & Ecosystem at CEVA. "Through this combination of technology, CEVA and Aricent can provide LTE terminal and infrastructure equipment manufacturers time-to-market, performance and cost advantages in a highly integrated, optimized LTE solution offering."
Aricent's modular implementation of the LTE Category 3 UE PHY provides building blocks that offer the flexibility to implement an LTE PHY using the most appropriate architecture for the target silicon. The modular format also allows replacing key processing modules (FFT, DFT, FEC, etc) with accelerators enabling power savings, while fully leveraging the processor architecture. Customers can select and optimize low-level functional modules or choose complete chains PUSCH or PRACH. The Aricent LTE PHY also offers configuration flexibility between the different channel bandwidth ranging from 1.4 to 20 MHz.
"This solution reflects our continued emphasis and investment in growing our ecosystem of technology leaders in the LTE space" explained Ajeet Velankar, business development director at Aricent. "CEVA's programmable DSP cores combined with Aricent's software solution accelerates development and reduces risk for customers, allowing them to focus on their core competencies and improve their competitive position in future design decisions."
Keywords & tags: UE (User Equipment), LTE, LTE Chipset, L1/L2/L3 Protocol Stack, LTE Reference Designs, DSP (Digital Signal Processors), 4G, SDR (Software-Defined Radio)
Aricent is a global innovation, technology and services company focused exclusively on communications. Aricent combines the leading innovation capabilities of frog design with unparalleled domain expertise in communications as a strategic supplier to the world's foremost infrastructure, application and service providers. The company's investors include Kohlberg Kravis Roberts & Co., Sequoia Capital, The Family Office and Flextronics International Ltd. For more information, visit www.aricent.com.
About CEVA, Inc.
Headquartered in San Jose, Calif., CEVA is a leading licensor of silicon intellectual property (SIP) DSP Cores and platform solutions for the mobile handset, portable and consumer electronics markets. CEVA's IP portfolio includes comprehensive solutions for multimedia, audio, voice over packet (VoP), Bluetooth and Serial ATA (SATA), and a wide range of programmable DSP cores and subsystems with different price/performance metrics serving multiple markets. In 2008, CEVA's IP was shipped in over 300 million devices. For more information, visit www.ceva-dsp.com
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