CEVA Partners with SMIC to Deliver Fully Functional Silicon for CEVA-TeakLite-III DSP Core

Silicon-proven on SMIC's advanced 90nm process technology, CEVA-TeakLite-III based chip dramatically accelerates time-to-market for HD audio, VoIP, Cellular baseband and more

SAN JOSE, Calif., May 11 /PRNewswire-FirstCall/ -- CEVA, Inc. [(NASDAQ: CEVA); ], a leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores, today announced the availability of fully-functional silicon for the 32-bit CEVA-TeakLite-III DSP core. The first chips were produced on SMIC's 90nm process and exceeded 600MHz.

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SoC developers can leverage the newly available silicon to dramatically reduce the risk, design effort, development cost and time-to-market associated with designing a wide range of wireless, consumer and portable products addressed by the CEVA-TeakLite-III DSP core. The dual-MAC, 32-bit processing architecture enables the core to reach operating speeds higher than 700 MHz in 65nm process. CEVA-TeakLite-III addresses multiple target applications, including low-cost 2G/2.5G/3G wireless baseband modems, wideband voice and audio processors, portable media players, voice-over-IP residential gateways and High Definition (HD) audio applications, supporting advanced audio standards such as Dolby Digital Plus 7.1, Dolby TrueHD and DTS-HD.

"We are pleased to partner with a world-class IP provider like CEVA to deliver functional silicon for their CEVA-TeakLite-III DSP core," said Henry Liu, Senior Director of Design Services at SMIC. "Our advanced, high performance 90nm process technology enables CEVA's customers quick prototyping and application development for their next generation products, using a leading-edge DSP test silicon."

"The availability of silicon for our 32-bit CEVA-TeakLite-III DSP core is a significant advancement for our DSP customers, eliminating any risk associated with DSP IP-based SoC design," said Aviv Malinovitch, Vice President Operations at CEVA. "As one of the world's leading semiconductor foundries, we are pleased to have partnered with SMIC for this important milestone and look forward to continued success together."

As the engine powering CEVA's HD Audio solution, the CEVA-TeakLite-III DSP core features strong bit-manipulation capabilities for stream processing and 32-bit FFT support to enable a highly efficient implementation of audio codecs. CEVA-TeakLite-III is available with a range of optimized HD audio codecs supporting from 2 channels up to 7.1 channels with various bit-rates. Audio codecs supported include: MP3, AAC-LC, HE-AAC, WMA, AC-3, RealAudio, Dolby Digital Plus, Dolby TrueHD, DTS, DTS-HD MA, DTS-HD HR and others.


CEVA-TeakLite-III silicon is available today. For more information, contact Email Contact

About CEVA, Inc.

Headquartered in San Jose, Calif., CEVA is a leading licensor of silicon intellectual property (SIP) DSP Cores and platform solutions for the mobile handset, portable and consumer electronics markets. CEVA's IP portfolio includes comprehensive solutions for multimedia, audio, voice over packet (VoP), Bluetooth and Serial ATA (SATA), and a wide range of programmable DSP cores and subsystems with different price/performance metrics serving multiple markets. In 2008, CEVA's IP was shipped in over 300 million devices. For more information, visit www.ceva-dsp.com

Web site: http://www.ceva-dsp.com/

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