Atmel Introduces Highly Integrated System-in-Package Solution for Automotive LIN Networking Applications

HEILBRONN, Germany, March 3 /PRNewswire/ -- Atmel(R) Corporation (NASDAQ: ATML) announced today the availability of a new System-in-Package (SiP) solution for LIN automotive networking applications. The ATA6617, featuring maximum integration, is the first member of an upcoming LIN SiP family. It combines Atmel's LIN System Basis Chip (SBC) ATA6624 - including LIN transceiver, voltage regulator, watchdog - and a well-known AVR(R) microcontroller (ATtiny167 with 16k flash memory) in a single package. With this highly integrated solution, customers can create complete LIN nodes using just one IC.

The new LIN SiP is based on Atmel's second-generation LIN IP with excellent EMC and ESD performance. It is optimized for low-cost LIN slave applications and enables system cost reductions of up to 25%. A powerful LIN UART with integrated hardware routines simplifies protocol stack handling and limits the interrupt generation, thus reducing the microcontroller load and flash memory consumption. Simple assignment of an individual physical LIN node address, which is important in applications such as air-conditioning systems, can be realized by using an integrated 100 microampere current source.

One important criteria for LIN applications is low current consumption. To ensure that the LIN node's current consumption is well below 100 microampere in applications that are continuously connected to the battery, the ATA6617 provides several current saving modes where different functionalities are individually switched off or on, depending on the application requirements.

All pins of the LIN system basis chip and the microcontroller are bonded out, thus providing customers the same flexibility and performance for their applications as with discrete parts.

Thanks to the extremely small QFN38 package, measuring only 5 mm x 7 mm, designers can save more than 50% of PCB size compared to conventional solutions.

Availability and Pricing

Samples of the new LIN IC ATA6617 are now available in small QFN38 packages. Pricing starts at US $1.89 for 10k-piece quantities. Various cost-effective tools support designers with the development of LIN networks. A development board is available that enables a quick start with the IC and allows prototyping and testing of new designs. Certified LIN 2.0 and 2.1 protocol stacks from leading suppliers are also available. Further LIN SiP family members, including an 8 kB flash memory version, will be announced in Q2 2009.

    Footnote
    EMC = Electro-Magnetic-Compatibility
    ESD = Electronic Static Discharge
    IP = Intellectual Property
    LIN = Local Interconnect Network
    PCB = Printed Circuit Board
    QFN = Quad Flat No leads
    SBC = System Basis Chip
    SiP = System-in-Package

About Atmel

Atmel is a worldwide leader in the design and manufacture of microcontrollers, advanced logic, mixed-signal, nonvolatile memory and radio frequency (RF) components. Leveraging one of the industry's broadest intellectual property (IP) technology portfolios, Atmel is able to provide the electronics industry with complete system solutions focused on consumer, industrial, security, communications, computing and automotive markets.

(C) 2009 Atmel Corporation. All Rights Reserved. Atmel(R), Atmel logo and combinations thereof, AVR(R) and others are registered trademarks or trademarks of Atmel Corporation or its subsidiaries. Other terms and product names may be trademarks of others.

Information:

Product information on Atmel's LIN SiP IC ATA6617 may be retrieved at: http://www.atmel.com/dyn/products/product_card.asp?part_id=4522

    Press Contacts:

    Dr. Susanne van Clewe, Marcom Director Automotive
    Phone: +49 7131 67-2081, Email:  susanne.van-clewe@atmel.com

    Helen Perlegos, Public Relations
    Phone: +1 408 487-2963, Email: Helen.perlegos@atmel.com

Web site: http://www.atmel.com/




Review Article Be the first to review this article
Rand3D

Featured Video
MCAD Corporate Newsletter
rss feed
Jobs
Mechanical Design Engineer 3 for KLA-Tencor at Milpitas, CA
Sr Mechanical Design Engineer for Medtronic at mounds view, MN
Senior Mechanical Engineer for BAE Systems Intelligence & Security at Arlington, VA
Geospatial Systems Administrator for BAE Systems Intelligence & Security at arnold, MO
Geospatial Analyst - Senior for BAE Systems Intelligence & Security at Springfield, VA
Urban Designer - Urban Design/Planning for SERA Architects, Inc at Portland, OR
Upcoming Events
ESPRIT World 2018 at Indianapolis Marriott Downtown 350 West Maryland Street Indianapolis IN - Jun 11 - 15, 2018
HxGN LIVE 2018 at The Venetian Las Vegas NV - Jun 12 - 15, 2018
IMTS2018 International Manufacturing Tech Show at McCormick Place Chicago IL - Sep 10 - 15, 2018
Kenesto: 30 day trial



Internet Business Systems © 2017 Internet Business Systems, Inc.
25 North 14th Steet, Suite 710, San Jose, CA 95112
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation GISCafe - Geographical Information Services TechJobsCafe - Technical Jobs and Resumes ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise