The new LIN SiP is based on Atmel's second-generation LIN IP with excellent EMC and ESD performance. It is optimized for low-cost LIN slave applications and enables system cost reductions of up to 25%. A powerful LIN UART with integrated hardware routines simplifies protocol stack handling and limits the interrupt generation, thus reducing the microcontroller load and flash memory consumption. Simple assignment of an individual physical LIN node address, which is important in applications such as air-conditioning systems, can be realized by using an integrated 100 microampere current source.
One important criteria for LIN applications is low current consumption. To ensure that the LIN node's current consumption is well below 100 microampere in applications that are continuously connected to the battery, the ATA6617 provides several current saving modes where different functionalities are individually switched off or on, depending on the application requirements.
All pins of the LIN system basis chip and the microcontroller are bonded out, thus providing customers the same flexibility and performance for their applications as with discrete parts.
Thanks to the extremely small QFN38 package, measuring only 5 mm x 7 mm, designers can save more than 50% of PCB size compared to conventional solutions.
Availability and Pricing
Samples of the new LIN IC ATA6617 are now available in small QFN38 packages. Pricing starts at US $1.89 for 10k-piece quantities. Various cost-effective tools support designers with the development of LIN networks. A development board is available that enables a quick start with the IC and allows prototyping and testing of new designs. Certified LIN 2.0 and 2.1 protocol stacks from leading suppliers are also available. Further LIN SiP family members, including an 8 kB flash memory version, will be announced in Q2 2009.
Footnote EMC = Electro-Magnetic-Compatibility ESD = Electronic Static Discharge IP = Intellectual Property LIN = Local Interconnect Network PCB = Printed Circuit Board QFN = Quad Flat No leads SBC = System Basis Chip SiP = System-in-Package
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