Option to extend collaboration with Intel on wireless modules for Mobile Internet Devices

LEUVEN, BELGIUM -- (MARKET WIRE) -- Oct 20, 2008 -- Option N.V. (EURONEXT Brussels: OPTI; OTC: OPNVY), the wireless technology company, today announced that it is developing a new 3.5G HSPA embedded module for the "Moorestown" platform, Intel's next generation Mobile Internet Device (MID) platform based on the Intel® Atom™ processor.

Option has collaborated with Intel since 2007, which has resulted in Option becoming the first company in the world to deliver a WWAN module that was physically small enough to fit in MIDs based on the Intel® Atom™ processor. Option's GTM501 is the only HSPA embedded module available in the ultra-compact LGA package that measures just 25 x 30 x 2.5 mm - making it the world's smallest HSPA module.

"With Moorestown, Intel is continuing their proud tradition of delivering on Moore's law by increasing processing speed and functionality while significantly reducing footprint and power consumption," said Jan Callewaert, CEO of Option. "Option's continued innovation with the new 3.5G HSPA embedded module will bring leading edge wireless connectivity to Intel's next generation Moorestown platform."

"High performance wireless connectivity is critical to the success of Mobile Internet Devices," said Anand Chandrasekher, Intel Corporation Senior Vice President and General Manager for the company's Ultra Mobility Group. "Option's expertise and experience with HSPA modules combined with Intel's innovation in delivering high performance and low power solutions, will help enable next generation Moorestown platforms to be always connected."

MIDs are a new category of portable and pocketable web-centric devices for consumers and business professionals that allow users to communicate with others, be entertained, access information or participate in online gaming - all while on-the-go. ABI Research recently forecast that the market for ultra-mobile devices - which include Netbooks and MIDs - will reach 200 million units a year in 2013.

For the PDF version of the press release in English or in Dutch, please click on the link below:

Option to extend collaboration with Intel on wireless modules for Mobile Internet Devices: http://hugin.info/133962/R/1260867/275972.pdf

Option breidt samenwerking met Intel uit voor draadloze modules voor MID's: http://hugin.info/133962/R/1260867/275973.pdf

This announcement was originally distributed by Hugin. The issuer is solely responsible for the content of this announcement.

Copyright © Hugin AS 2008. All rights reserved.

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