TI simplifies complex signal generation with wide bandwidth digital-to-analog converter and amplifier development tool

Kit extends TI's world-class support for high-speed analog designs

DALLAS, Sept. 8 /PRNewswire/ -- Texas Instruments Incorporated (TI) (NYSE: TXN) introduced today a leading-edge support tool that enables designers to rapidly evaluate signal chain performance for test and measurement, industrial and communications applications, including arbitrary waveform and signal generators. The development kit simplifies the complexity of interfacing between high-speed digital-to-analog converters (DAC) and amplifiers and includes clocking and power management devices to further ease design and reduce cycle time. In addition, the tool provides customers with the flexibility to implement alternative design configurations based on the unique requirements of the system, all configurable via an easy-to-use graphical user interface (GUI). (For more information, see http://www.ti.com/tsw3070-pr)

The TSW3070 development kit includes a high-speed DAC, two amplifiers, a complete on-board clocking solution and power supply circuitry, including the following:

    --  DAC5682Z dual-channel, 1-GSPS DAC with current sink output
    --  OPA695 current feedback amplifier with 1.4-GHz bandwidth
    --  THS3091/5 high voltage swing amplifier with 30-V supply voltage
    --  CDCM7005 jitter cleaner with 800-MHz VCXO and 10-MHz reference
    --  TPS7675x, TPS5430, UCC284-5 on board voltage supply solution from a
        single 6-V wall supply

In addition, the kit also features a user-friendly GUI for easy DAC configuration.

The TSW3070 provides designers with the flexibility to implement multiple configuration options. The DAC5682Z converter with LVDS interface offers many digital features which can be configured using the GUI such as:

    --  Selectable low-, high-, or bypass filter modes
    --  Interpolation: 2x, 4x or bypass
    --  Optional +/-Fs/4 or +/-Fs/8 coarse mixer
    --  8 sample input data FIFO

Designers can drive the DAC output to either the OPA695 or the THS3091/5, enabling customers to evaluate a high-frequency signal to support wide bandwidth or a large signal swing. The amplifiers also simplify the signal chain requirement for level-shifting, gain and differential to single-ended conversion while taking into consideration the DAC compliance voltage and output current specification. As an additional option, designers can bypass the amplifiers and send the signal to a passive transformer output without gain.

TI offers a host of other market-leading solutions-based tools to address customer design challenges, reduce prototyping costs and speed development time. For instance, customers can utilize the LVDS outputs from TI's TSW3100 digital pattern generator to drive the LVDS bus into the TSW3070's DAC5682Z input interface with up to 256 mega vector pattern depths. For more information, see http://www.ti.com/tsw3100.

Availability and pricing

The TSW3070 demonstration kit is available today at http://www.ti.com/tsw3070. Pricing is $499.

For more information on tools to make it easier to design with TI's analog products, please visit the Analog eLabTM Design Center at http://www.ti.com/analogelab

About Texas Instruments

Texas Instruments (NYSE: TXN) helps customers solve problems and develop new electronics that make the world smarter, healthier, safer, greener and more fun. A global semiconductor company, TI innovates through manufacturing, design and sales operations in more than 25 countries. For more information, go to http://www.ti.com.

Texas Instruments is traded on the New York Stock Exchange under the symbol TXN. More information is located on the World Wide Web at http://www.ti.com.

          Please refer all reader inquiries to:
          Texas Instruments Incorporated
          Semiconductor Group, SC-08114
          Literature Response Center
          14950 FAA Blvd.
          Fort Worth, TX  76155


Analog eLab is a trademark of Texas Instruments. All other registered trademarks and other trademarks are the property of their respective owners.

Web site: http://www.ti.com/

Review Article Be the first to review this article

SolidCAM - See it Live

Featured Video
Associate Packaging Engineer for Unilever at Englewood Cliffs, New Jersey
Vice President, GIS Business Unit for RAMTeCH Software Solutions, Inc. at Stillwater, Minnesota
GIS ANALYST for Cobb County Government at Marietta, California
GIS Analyst for Institute for Children and Poverty at New York, California
GIS Engineer III for Nebraska State Government at Lincoln|, Nebraska
Upcoming Events
COMSOL Conference 2018 Lausanne at SwissTech Convention Center Quartier Nord EPFL, Route Louis-Favre 2, 1024 Ecublens Switzerland - Oct 22 - 24, 2018
6th OpenFOAM Conference 2018 at Radisson Blu Hotel, Hamburg Airport Flughafenstraße 1-3 Hamburg Germany - Oct 23 - 25, 2018
ASSESS 2018 CONGRESS at Chateau Elan Winery & Resort 100 Rue Charlemagne, Braselton GA - Oct 28 - 30, 2018
MEMS & Sensors Executive Congress—MSEC 2018 at Silverado Resort and Spa 1600 Atlas Peak Road Napa CA - Oct 28 - 30, 2018
Kenesto: 30 day trial

Internet Business Systems © 2018 Internet Business Systems, Inc.
25 North 14th Steet, Suite 710, San Jose, CA 95112
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation GISCafe - Geographical Information Services TechJobsCafe - Technical Jobs and Resumes ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise