Sonics Demos at the Design Automation Conference; Summit Design and CoWare to Showcase Ease of Integration With Sonics SystemC Models and ESL Tools

MOUNTAIN VIEW, Calif.—(BUSINESS WIRE)—July 21, 2006— Sonics Inc.(R), the premier supplier of system-on-chip (SoC) SMART Interconnect(TM) solutions, will join Summit Design, booth# 1028 and CoWare Inc., booth# 3173 at the 43rd annual Design Automation Conference at Moscone Center, San Francisco. Demonstrations will be available that highlight the ease of integration of SoC interconnect solutions using ESL tools.

Additionally, Sonics chief technology officer, Drew Wingard, will speak at Summit Design's 4th Annual DAC ESL Technology Symposium on July 25 from 12 p.m. to 2 p.m. in room 200 of Moscone Center. The topic of the panel discussion is "Putting ESL to work: Successful IP selection, integration and interoperability for effective ESL Design."

About Sonics

Sonics, Inc.(R) is the premier supplier of SMART Interconnect(TM) solutions that deliver high SoC design predictability and increased design efficiency. Major semiconductor and systems companies including Broadcom, Texas Instruments, Toshiba, and Samsung have applied Sonics' SMART Interconnects solutions in leading products in the wireless communications, digital multimedia, automotive, and office products markets. Sonics is a privately-held company funded by Cadence Design Systems, Toshiba Corp., Samsung Ventures, and venture capital firms Investar Capital, Smart Technology Ventures, TL Ventures, Easton Hunt Capital, JAFCO Ventures, and H&Q Asia-Pacific. For more information, see www.sonicsinc.com

Sonics and SMART Interconnects are registered trademarks of Sonics, Inc. All other trademarks are the property of their respective owners.



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