Lattice Semiconductor Continues to Bolster Design Tool Suites for Low-Power, Small Form Factor FPGAs

Lattice Diamond® Software Suite Version 3.7 Enhances Performance of ECP5™ and MachXO™ FPGA Product Families

Click-to-Tweet

  • Version 3.7 features expanded support for Lattice FPGAs
  • Enhancements to the Lattice Synthesis Engine enable more efficient, smaller area, less power hungry implementations of Lattice FPGAs

PORTLAND, Ore. — (BUSINESS WIRE) — February 22, 2016Lattice Semiconductor Corporation (NASDAQ: LSCC), the leading provider of customizable smart connectivity solutions, today announced availability of an updated version of its Lattice Diamond® design tool suite, version 3.7. It includes support for more Lattice devices as well as performance improvements to help customers design solutions based on Lattice FPGAs with the lowest possible size, power consumption and cost.

Lattice Diamond design software is a complete suite of FPGA tools with an easy-to-use interface, efficient design flow, superior design exploration and more. Key new features in version 3.7 include support for the expanded ECP5™ and MachXO2™/MachXO3™ FPGA families.

  • Latest software updates for ECP5-5G™ family, the first FPGA family to support 5G SERDES and up to 85K LUTs in a small 10x10 mm package. Click here to request a license to access ECP5-5G devices in the software.
  • Software support for new ECP5 12K device that enables cost optimized programmable IO bridging functionality in a variety of end markets.
  • Software support for enhanced features in MachXO2 and MachXO3 FPGAs including low-voltage I/O support, password protection against malicious erase commands, and soft error detection and correction support (SED/SEC).
  • Support for new MachXO2 QFN32 package to implement functionality such as power management, bridging and signal aggregation in a variety of Industrial applications.
  • Improvements to the Lattice Synthesis Engine (LSE) used in the tool suite allow for smaller footprint and design productivity.

“The small size, low power consumption and high performance of our FPGA families make them the ideal connectivity solution for consumer, industrial and communications applications,” said Hua Xue, vice president, software systems and solutions at Lattice Semiconductor. “With these updates to our popular Lattice Diamond software suite, our customers will be able to achieve their design goals without compromising device functionality.”

For more information about the Lattice Diamond software suite and to download version 3.7, please visit the Lattice website.

About Lattice Semiconductor

Lattice Semiconductor (NASDAQ: LSCC) is a global leader in smart and connected solutions. Our customers rely on our ultra-low power, small form-factor Programmable Logic Devices, standards-driven video connectivity ASSPs, high-bandwidth 60 GHz millimeter wave wireless devices, and intellectual property to quickly develop faster, sleeker, and more responsive devices for the Consumer, Communications, and Industrial markets.

Lattice was founded in 1983 and is headquartered in Portland, Oregon. For more information, visit www.latticesemi.com. You can also follow us via LinkedIn, Twitter, Facebook, YouTube or RSS.

Lattice Semiconductor Corporation, Lattice Semiconductor (& design), Lattice Diamond, ECP5, ECP5-5G, MachXO, MachXO2, MachXO3, and specific product designations are either registered trademarks or trademarks of Lattice Semiconductor Corporation or its subsidiaries in the United States and/or other countries.

GENERAL NOTICE: Other product names used in this publication are for identification purposes only and may be trademarks of their respective holders.



Contact:

MEDIA CONTACTS:
Lattice Semiconductor
Sherrie Gutierrez, 408-616-4017
Email Contact
or
Voce Communications
Bob Nelson, 408-738-7889
Email Contact
or
INVESTOR CONTACT:
Global IR Partners
David Pasquale, 914-337-8801
Email Contact




Review Article Be the first to review this article
Featured Video
Editorial
Jeff RoweJeff's MCAD Blogging
by Jeff Rowe
GE Additive’s Big Plans For Metal AM
Jobs
Mechanical Engineer II - Requisition ID 090445 for L3 Technologies at New York, NY
ECAD Designer - Data Connectivity for Delphi at Auburn Hills, MI
Estimator / Bidder for Rulon International at Saint Augustine, FL
Upcoming Events
33rd Annual Coordinate Metrology Society Conference at Snowbird UT - Jul 17 - 21, 2017
EMO Hannover 2017 at Hannover Germany - Sep 18 - 23, 2017
The 30th Annual Integrated Process Excellence Symposium & Training at Wyndham Grand Bonnet Creek Resort Orlando FL - Sep 18 - 20, 2017
Additive Manufacturing Conference 2017 at Knoxville Convention Center 701 Henley Street Knoxville TN - Oct 10 - 12, 2017
SolidCAM: 10K CAM Contest



Internet Business Systems © 2017 Internet Business Systems, Inc.
595 Millich Dr., Suite 216, Campbell, CA 95008
+1 (408)-337-6870 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation GISCafe - Geographical Information Services TechJobsCafe - Technical Jobs and Resumes ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy Policy Advertise