Cadence executives and partners to present and demonstrate the latest processors, IP and moreSAN JOSE, Calif., Feb. 17, 2015 — (PRNewswire) —
Cadence Design Systems, Inc. (NASDAQ: CDNS) is scheduled to demonstrate its latest advancements and solutions for mobile technology challenges, in collaboration with customers and partners, at Mobile World Congress (MWC) 2015. To sign up for a private demo or discussion at the show, email: Email Contact.
March 2 - March 6, 2015
Visit Cadence at Mobile World Congress 2015, in Barcelona, Spain:
- Cadence® booth, Hall 6, Stand 6L36
- Visit Cadence's booth to see demonstrations of the industry's highest performance and most energy-efficient audio/voice digital signal processing (DSP) intellectual property (IP) cores for system-on-chip (SoC) designs. Visitors can see the Tensilica® HiFi Audio/Voice DSP IP cores as well as fully integrated IP sub-systems featuring Tensilica image/video processor DSP, automotive Ethernet IP, and IP for MIPI protocols.
Cadence enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software, hardware, IP, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available at www.cadence.com.
© 2015 Cadence Design Systems, Inc. All rights reserved worldwide. Cadence, Tensilica and the Cadence logo are registered trademarks of Cadence Design Systems, Inc. in the United States and other countries. All other trademarks are the property of their respective owners.
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SOURCE Cadence Design Systems, Inc.
|Cadence Design Systems, Inc.