eASIC Demonstrates 10Gbps JEDEC JESD204B

SANTA CLARA, Calif. — (BUSINESS WIRE) — December 8, 2014eASIC Corporation, (@easic) a fabless semiconductor company delivering a custom IC platform (eASIC Platform) announced today that it has successfully completed JESD204B interoperability at 10 Gbps lane rates. Analog Devices’ AD9234 12-bit, 1.0-GSPS high-speed dual analog-to-digital converter (ADC) can interoperate with the eASIC Nextreme-3 28nm, which greatly simplifies the design and integration of high bandwidth multi-channel radios.

“eASIC’s innovative platform enables OEMs to develop custom silicon solutions with optimal power, price, performance and time-to-market,” said Christian Lanzani, Director for Wireless at eASIC Corporation. “The combination of ADI’s AD9234 high-speed dual ADC and eASIC Nextreme-3 platform allows designers to optimize performance and power in developing next generation of energy-efficient backhaul, fronthaul and remote radio head systems.”

“Growing consumer demand for bandwidth requires radio solutions that deliver increased data throughput and lower power consumption. This trend is driving the adoption of the JESD204B interface standard in cellular back and front haul wireless network equipment,” said Paul Ganci, strategic marketing manager, point-to-point radio solutions, Analog Devices. “ADI offers a large portfolio of JESD204B supported products that enable customers to reduce their overall time to market.”

Click here for interoperability report: http://www.easic.com/products/request-documentation/

Click to Tweet- @easic #JESD204B interoperability report

About eASIC

eASIC is a fabless semiconductor company offering a custom IC platform (eASIC Platform) that incorporates a versatile base array, customizable single-mask layer and proprietary design tools. The breakthrough eASIC Platform provides the optimal combination of fast time-to-market, high performance, low power consumption, low development cost and low unit cost. The innovative eASIC Platform is enabled through a patented technology utilizing a single via mask layer for customizable and avoids the painful tradeoffs associated with ASICs, ASSPs and FPGAs.

Privately held eASIC Corporation is headquartered in Santa Clara, California. Investors include Khosla Ventures, Kleiner Perkins Caufield and Byers (KPCB), Crescendo Ventures, Seagate Technology and Evergreen Partners. For more information on eASIC please visit www.easic.com/news or follow us on Twitter @easic.com.



Contact:

eASIC Corporation
Carey Mitchell, 408-855 9200
Email Contact




Review Article Be the first to review this article
Rand3D

SolidCAM: SolidCAM SEE IT LIVE

Featured Video
Jobs
System Designer/Engineer for Bluewater at Southfield, MI
Mechanical Engineer for Allen & Shariff Corporation at Pittsburgh, PA
Director of Process Engineering. for Tekni-Plex at Toledo, OH
Project Manager for Keystone Aerial Surveys at Philadelphia, PA
GIS Specialist for Fresno Irrigation District at Fresno, CA
Geospatial Analyst/Programmer for LANDIQ at Sacramento, CA
Upcoming Events
Manufacturing in America 2018 at Ford Field 1902 St. Antoine, Detroit MI - Mar 14 - 15, 2018
ACE 2018 Conference at The Westin Indianapolis 241 W Washington St Indianapolis IN - Mar 20 - 22, 2018
ESPRIT World 2018 at Indianapolis Marriott Downtown 350 West Maryland Street Indianapolis IN - Jun 11 - 15, 2018
HxGN LIVE 2018 at The Venetian Las Vegas NV - Jun 12 - 15, 2018
Kenesto: 30 day trial
Tebis
MasterCAM



Internet Business Systems © 2018 Internet Business Systems, Inc.
25 North 14th Steet, Suite 710, San Jose, CA 95112
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation GISCafe - Geographical Information Services TechJobsCafe - Technical Jobs and Resumes ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise