Cadence Wins Two TSMC Partner of the Year Awards for Soft IP and 16FF+ Solutions

SAN JOSE, Calif., Oct. 9, 2014 — (PRNewswire) — Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced that it has won two TSMC Partner of the Year awards during the TSMC Open Innovation Platform® (OIP) Ecosystem Forum. Cadence was presented with awards for both Soft IP and joint development of 16nm FinFET Plus (16FF+) design infrastructure.

Cadence Logo

 TSMC determined the Soft IP award winner based on customer feedback, portfolio breadth, and strong technical support capabilities. The Cadence IP portfolio offers an extensive range of widely used protocols including DDR, PCIe, USB, Ethernet and HDMI.

The award for joint development of 16FF+ design infrastructure was given based on the early, in-depth collaboration between TSMC and Cadence on FinFET enablement and the development of this latest advanced node technology for next generation System-on-Chip (SoC) designs. Cadence tools certified for 16FF+ include Encounter® Digital Implementation System, Tempus™ Timing Signoff Solution, Voltus™ IC Power Integrity Solution, Quantus™ QRC Extraction Solution, Virtuoso® custom design platform, Spectre® simulation platform, Physical Verification System, Litho Physical Analyzer and CMP Predictor.

"We presented the awards to Cadence based on the quality results delivered through its Soft IP and 16FF+ solutions," said Suk Lee, TSMC senior director, Design Infrastructure Marketing Division. "Cadence has demonstrated its commitment to working closely with us to bring the highest quality design capabilities to IC designers around the world, and we look forward to continuing our partnership in the years to come."

"Cadence IP and tools enable customers to address their power, performance and area requirements so they can deliver the best quality designs within tight market windows," said Dr. Chi-Ping Hsu, senior vice president, chief strategy officer, EDA and chief of staff to the CEO at Cadence. "The award recognition from TSMC reflects our long-standing relationship and further demonstrates our ongoing commitment to delivering a strong IP portfolio and advanced node technology for next generation SoC designs. We've already begun working with TSMC on the 10nm certification process, and our tight collaboration continues to drive EDA innovation forward." 

About Cadence
Cadence enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software, hardware, IP, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available here.

©2014 Cadence Design Systems, Inc. All rights reserved worldwide. Cadence, Encounter, Spectre, Virtuoso and the Cadence logo are registered trademarks and Tempus, Quantus and Voltus are trademarks of Cadence Design Systems, Inc. in the United States and other countries. All other trademarks are the property of their respective owners.

For more information, please contact:
Cadence Newsroom
408-944-7039
Email Contact

Logo - http://photos.prnewswire.com/prnh/20140102/SF39436LOGO

SOURCE Cadence Design Systems, Inc.

Contact:
Cadence Design Systems, Inc.
Web: http://www.cadence.com




Review Article Be the first to review this article

Featured Video
Jobs
Associate Packaging Engineer for Unilever at Englewood Cliffs, New Jersey
Senior Account Manager, Utilities for RAMTeCH Software Solutions, Inc. at Stillwater, Minnesota
GIS ANALYST for Cobb County Government at Marietta, California
Vice President, GIS Business Unit for RAMTeCH Software Solutions, Inc. at Stillwater, Minnesota
BIM / REVIT Senior Structural Modeler for McNamara Salvia at New York, California
Upcoming Events
COMSOL Conference 2018 Lausanne at SwissTech Convention Center Quartier Nord EPFL, Route Louis-Favre 2, 1024 Ecublens Switzerland - Oct 22 - 24, 2018
6th OpenFOAM Conference 2018 at Radisson Blu Hotel, Hamburg Airport Flughafenstraße 1-3 Hamburg Germany - Oct 23 - 25, 2018
ASSESS 2018 CONGRESS at Chateau Elan Winery & Resort 100 Rue Charlemagne, Braselton GA - Oct 28 - 30, 2018
MEMS & Sensors Executive Congress—MSEC 2018 at Silverado Resort and Spa 1600 Atlas Peak Road Napa CA - Oct 28 - 30, 2018
Kenesto: 30 day trial



Internet Business Systems © 2018 Internet Business Systems, Inc.
25 North 14th Steet, Suite 710, San Jose, CA 95112
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation GISCafe - Geographical Information Services TechJobsCafe - Technical Jobs and Resumes ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise