Cadence Digital and Custom/Analog Tools Achieve TSMC Certification for 16FF+ Process, Companies Collaborate on 10nm FinFET

10nm FinFET Process Collaboration Enables Immediate Early Customer Design Starts

SAN JOSE, Calif., Sept. 26, 2014 — (PRNewswire) —  Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced that its digital and custom/analog tools have achieved V0.9 Design Rule Manual (DRM) and SPICE certification from TSMC for its 16FF+ process, enabling systems and semiconductor companies to take advantage of the 15 percent speed improvement with the same total power compared to 16nm FinFET, or 30 percent total power reduction at the same speed compared to 16nm FinFET. 16FF+ V1.0 certification is on track to be concluded by November 2014. Cadence® also collaborated with TSMC to make several enhancements to its Custom Design Reference Flow (CDRF) for the 16FF+ process. Additionally, Cadence and TSMC are collaborating on the 10nm FinFET process, and Cadence solutions are ready to support 10nm early customer design starts.

Cadence Logo.

The Cadence custom/analog and digital implementation and signoff tools have been validated by TSMC on high-performance reference designs in order to provide customers with the fastest path to design closure. Cadence tools certified for 16FF+ include Encounter® Digital Implementation System, Tempus™ Timing Signoff Solution, Voltus™ IC Power Integrity Solution, Quantus™ QRC Extraction Solution, Virtuoso® custom design platform, Spectre® simulation platform, Physical Verification System, Litho Physical Analyzer and CMP Predictor.

Enhancements to the CDRF include an exclusive TSMC application programming interface (API) incorporated into Virtuoso Analog Design Environment GXL that speeds up statistical simulation flow, a new design methodology leveraging module generator (ModGen) technology for designing FinFET arrays to avoid density gradient effects, and the introduction of the electrically aware design (EAD) platform to extract and analyze real-time parasitics and electromigration (EM) violations during design implementation. Cadence tools in the flow include Virtuoso custom design platform, Integrated Physical Verification System, Physical Verification System, Quantus QRC Extraction Solution, Spectre simulation platform, Voltus-Fi Custom Power Integrity Solution and Litho Electrical Analyzer.

Cadence also announced today a broad portfolio of intellectual property (IP) for TSMC's 16nm FinFET Plus (16FF+) process. Click here for more information.

"We worked closely with Cadence to certify tools for customers to enjoy the benefits of higher performance and lower power consumption of TSMC's 16nm FinFET Plus process," said Suk Lee, TSMC senior director, Design Infrastructure Marketing Division. "The design tools and manufacturing process have been tested to ensure they work seamlessly together so that customers can achieve reduced iterations and improved predictability. Moreover, we are actively collaborating with Cadence on the 10nm FinFET process, and the joint flow is ready for early customer designs."

"Innovation is at the core of our business, and that's why we continue to invest in our partnership with TSMC and the development of 16nm and 10nm FinFET technologies," said Dr. Chi-Ping Hsu, senior vice president, chief strategy officer, EDA and chief of staff to the CEO at Cadence. "TSMC and Cadence work closely together to drive advancements that help our customers stay at the forefront of silicon technology. Customers that create chips for the world's newest mobile devices are already tapping into the benefits of the 16nm FinFET Plus design flows and can start to adopt 10nm FinFET solutions to overcome design complexity and get to market faster."

About Cadence

Cadence enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software, hardware, IP, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available here.

© 2014 Cadence Design Systems, Inc. All rights reserved worldwide. Cadence, the Cadence logo, Encounter, Spectre, and Virtuoso are registered trademarks and Liberate, Quantus, Tempus, and Voltus are trademarks of Cadence Design Systems, Inc. in the United States and other countries. All other trademarks are the property of their respective owners.

For more information, please contact:
Cadence Newsroom
Email Contact

Logo -

SOURCE Cadence Design Systems, Inc.

Cadence Design Systems, Inc.

Review Article Be the first to review this article
Autodesk - DelCAM

Featured Video
Jeff RoweJeff's MCAD Blogging
by Jeff Rowe
Apple Adding To Computer Product Line Minus Ports
Currently No Featured Jobs
Upcoming Events
3D Collaboration & Interoperability Congress at 1310 Washington Ave. Golden CO - Oct 25 - 26, 2016
Electric&Hybrid Aerospace Technology Symposium 2016 at Conference Centre East. Koelnmesse (East Entrance) Messeplatz 1 Cologne Germany - Nov 9 - 10, 2016
Autodesk University Las Vegas at Las Vegas NV - Nov 15 - 17, 2016
Colortrac: LearnMore
TurboCAD pro : Free Trial

Internet Business Systems © 2016 Internet Business Systems, Inc.
595 Millich Dr., Suite 216, Campbell, CA 95008
+1 (408)-337-6870 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation GISCafe - Geographical Information Services TechJobsCafe - Technical Jobs and Resumes ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy Policy Advertise