Media Alert: Cadence to Demonstrate 16FF+ Design Solutions at TSMC 2014 OIP Ecosystem Forum

SAN JOSE, Calif., Sept. 25, 2014 — (PRNewswire) —  Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, today announced it is scheduled to demonstrate how it leverages the TSMC Open Innovation Platform® (OIP) to optimize customer designs and manufacturing efficiency to ensure first-time product success on the 16nm FinFET Plus (16FF+) process at TSMC 2014 OIP Ecosystem Forum. The event is being held on September 30, 2014 in San Jose, CA, and Cadence will be in booth #614.

Cadence Logo.

WHAT:
Cadence is scheduled to deliver the following presentations in the EDA and IP tracks:

  • In-Design Signoff Key to Design Rule Check (DRC) Turnaround Time for 16nm IC Designs: 11:00–11:30am, Esther Tsai, staff product engineer at Cadence
  • 10nm FEOL/MEOL Challenges and Process Development with Parasitic RC Extractions: 1:30–2:00pm, Hao Ji, software engineering group director at Cadence, and Sean Lee, deputy director at TSMC
  • DDR4 Subsystem Implementation on 16FF/16FF+ Targeting Infrastructure Applications—Challenges and Design Techniques: 2:30–3:00pm, Anurag Jain, design engineering director at Cadence
  • Tempus  Timing Signoff Solution for Certification in 16FF/10FF TSMC Flows: 4:00–4:30pm, Florentin Dartu, senior program manager at TSMC
  • Managing 16FF IC Design Challenges for Custom and Analog Designers: 4:30–5:00pm, Akshat Shah, product engineering director at Cadence
  • Tackling Coloring, Cell Pin Access, Variability, and Late-Stage ECOs for TSMC 10nm with Cadence® Encounter® Digital Implementation System: 5:00–5:30pm, Rahul Deokar and Ruben Molina, product marketing directors at Cadence

In addition, Cadence plans to showcase its 16FF+ design solutions in booth #614 including:

  • Digital implementation solutions (front-end design (FED) and Encounter Digital Implementation System)
  • Virtuoso® custom solutions
  • Physical signoff and verification (PVS/DFM) solutions
  • Electrical signoff solutions
  • Custom/mixed-signal flow solutions
  • 3D-IC solutions
  • DDR4 16FF PHY and controller IP solutions

To register for the conference, click here.

WHEN:
The TSMC 2014 OIP Ecosystem Forum is scheduled for September 30, 2014.

WHERE: 
Santa Jose Convention Center in San Jose, CA
Cadence is located in booth #614.

About Cadence

Cadence (NASDAQ: CDNS) enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software, hardware, IP, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available here.

© 2014 Cadence Design Systems, Inc. All rights reserved worldwide. Cadence, the Cadence logo, Encounter, and Virtuoso are registered trademarks and Tempus is a trademark of Cadence Design Systems, Inc. in the United States and other countries. All other trademarks are the property of their respective owners.

For more information, please contact:
Cadence Newsroom
408-944-7039
Email Contact

Logo - http://photos.prnewswire.com/prnh/20140102/SF39436LOGO

SOURCE Cadence Design Systems, Inc.

Contact:
Cadence Design Systems, Inc.
Web: http://www.cadence.com




Review Article Be the first to review this article

Featured Video
Editorial
Jeff RoweJeff's MCAD Blogging
by Jeff Rowe
Siemens Goes ECAD With Mentor Graphics Acquisition
Jobs
Mechanical Engineer for IDEX Corporation at West Jordan,, UT
GIS Analyst II for Air Worldwide at Boston, MA
Senior Structural Engineer for Design Everest at San Francisco, CA
Business Partner Manager for Cityworks - Azteca Systems, LLC at Sandy, UT
Upcoming Events
Design & Manufacturing, Feb 7 - 9, 2017 Anaheim Convention Center, Anaheim, CA at Anaheim Convention Center Anaheim CA - Feb 7 - 9, 2017
Innorobo 2017 at Docks de Paris Paris France - May 16 - 18, 2017
Display Week 2017 at Los Angeles Convention Center 1201 S Figueroa St Los Angeles CA - May 21 - 26, 2017



Internet Business Systems © 2016 Internet Business Systems, Inc.
595 Millich Dr., Suite 216, Campbell, CA 95008
+1 (408)-337-6870 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation GISCafe - Geographical Information Services TechJobsCafe - Technical Jobs and Resumes ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy Policy Advertise