LTE Protocol Stack from NextG-Com Now Available on Cadence Tensilica Processor

SAN JOSE, Calif. and STAINES UPON THAMES, United Kingdom, June 24, 2014 — (PRNewswire) —  Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, and NextG-Com, an expert in embedded software products and services for LTE, M2M and satellite communications, today announced that NextG-Com has completed its port of the ALPS520 LTE Layer 2 and 3 protocol to the Cadence® Tensilica® ConnX BSP3 processor core. This combined hardware/software solution can be used to speed the design of LTE modems for cellular phones, tablets and other end-user equipment.

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The NextG-Com ALPS520 LTE protocol stack implements Layers 2 and 3 for FDD and TDD User Equipment (UE) terminals compliant to 3GPP Release 11. The ALPS520 is fully tested against 3GPP 36.523 conformance tests. The protocol stack components also come with a host of tools (Trace, ASN.1, SE-RTOSTM), which aid in faster product development.

The ConnX BSP3 core is an optimized LTE Layer 1, 2 and 3 dataplane processor (DPU), ideal for system control and layers 2 and 3 protocol stacks. This core, coupled with the ConnX BBE DSP cores and the ConnX SSP16DPU, enables SoC developers to quickly implement software-programmable wireless communication modems. 

"The NextG-Com team has developed a modular architecture protocol stack, leveraging the enhanced features of the BSP3, which is optimized for the low-level bit manipulation typical of L1 and L2 functionality," stated Eric Dewannain, Cadence's senior group director of baseband products. "Together with NextG-Com we can offer customers a total solution for fast implementation of LTE mobile devices."

"The Tensilica ConnX BSP3 core offers a very small size and low-power implementation for LTE Layers 1, 2 and 3 for UE modem designs," stated Denis Bidinost, CEO, NextG-Com. "Given Cadence's great success in LTE designs, we are very excited about this partnership. Our roadmap for 3GPP Release 12 support and onwards is intended to enable both companies to continue to work together in the future."

About NextG-Com
NextG-Com Limited is a UK-based independent technology development company specializing in software services and embedded system components for LTE, satellite and M2M standards. With a proven record of delivery, we provide our global Tier1 semiconductor partners, modem and device developers with protocol stack design services and full life-cycle software support, from requirements/feasibility study through to interoperability and live network testing. Further details can be viewed at http://www.nextgcom.co.uk.

About Cadence
Cadence enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software, hardware, IP, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available here.

© 2014 Cadence Design Systems, Inc. All rights reserved worldwide. Cadence, the Cadence logo, and Tensilica are registered trademarks of Cadence Design Systems, Inc. in the United States and other countries. All other trademarks are the property of their respective owners.

Cadence Newsroom

Colin Aitken

408-944-7039

+44 1784 462198

newsroom@cadence.com

colin.aitken@nextgcom.co.uk

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SOURCE Cadence Design Systems, Inc.

Contact:
Cadence Design Systems, Inc.
NextG-Com
Web: http://www.cadence.com




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