X-FAB to Exhibit 3-Axis Inertial Sensor Technology at Sensors Expo 2014

ERFURT, Germany – (BUSINESS WIRE) – Jun. 20, 2014 

Who

X-FAB, the leading analog/mixed-signal and MEMS foundry

What

Will exhibit its open-platform MEMS 3-axis inertial sensor process that is now available for volume manufacturing. This MEMS technology is suitable for a wide range of applications such as mobile devices, consumer goods, games and toys, automotive and robotics applications, and industrial and medical equipment that use 3D accelerometers or gyroscopes. The 3-axis inertial sensor technology comes with a complete set of design rules, process specifications and X-FAB’s own design-rule checking software to verify designs prior to silicon production.

In addition to the MEMS sensor technologies, X-FAB will discuss its modular CMOS process technologies that are ideal for implementing a broad range of sensing applications, signal conditioning and signal-processing devices. For designers of opto-electric sensors, various diodes and transistors are available that can be used as photo diodes or transistors for light-sensing applications.

When/Where

Sensors Expo & Conference, Booth #821

Wednesday, June 25, 2014 – 10 a.m.-5 p.m.

Thursday, June 26, 2014 - 10 a.m.-3 p.m.

Donald E. Stephens Convention Center, Hall G

9301 W. Bryn Mawr Ave; Rosemont, IL 60018

http://www.sensorsmag.com/sensors-expo

About X-FAB

X-FAB is the leading analog/mixed-signal and MEMS foundry manufacturing silicon wafers for automotive, industrial, consumer, medical and other applications. Its customers worldwide benefit from the highest quality standards, manufacturing excellence and innovative solutions by using X-FAB’s modular CMOS processes in geometries ranging from 1.0 to 0.18 µm, and its special BCD, SOI and MEMS long-lifetime processes. The analog-digital integrated circuits (mixed-signal ICs), sensors and micro-electro-mechanical systems (MEMS) are manufactured at five production facilities in Germany, Malaysia and the U.S. X-FAB employs 2,400 people worldwide. For more information, please visit www.xfab.com.

Acronyms

3D: Three-dimensional
BCD: Bipolar CMOS/DMOS
BiCMOS: Bipolar junction transistor and CMOS transistor integration
CMOS: Complementary metal oxide semiconductor
MEMS: Microelectromechanical systems
SOI: Silicon on Insulator




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