Si2 MEDIA ALERT: Press Conference with STMicroelectronics on Commitment to the Open Process Design Kit

SAN FRANCISCO & SAN JOSE, Calif. — (BUSINESS WIRE) — June 2, 2014 — Silicon Integration Initiative:

What: The Silicon Integration Initiative (Si2) is sponsoring a Press Conference featuring Philippe Magarshack, Executive Vice President, Design Enablement and Services, STMicroelectronics. Mr. Magarshack’s announcement is entitled “OpenPDK Production Value and Benchmark Results at STMicroelectronics.”

Jim Culp of IBM and Chair of Si2’s OpenPDK Coalition, will also present a short talk entitled “Technology Overview: What is OpenPDK?” which will provide technical background to introduce Mr. Magarshack’s talk. The Open Process Specification (OPS) is a foundation technology in the OpenPDK Coalition. For more information on this technology, see this link: http://www.si2.org/?page=1127

When/Where: The Press Conference will be held on Monday, June 2, at 1:00PM, in Room 300 of the Moscone Convention Center, San Francisco, during the Design Automation Conference.

Agenda: The agenda and more information is located at this link: http://www.si2.org/dac_2014/abstracts/prconf_abstract.php

About the OpenPDK Coalition and Si2

OpenPDK Member Companies: AnaGlobe Technology, GLOBALFOUNDRIES, IBM (NYSE: IBM), Intel (NASDAQ: INTC), Mentor Graphics (NASDAQ: MENT), NXP (NASDAQ: NXPI), Samsung Electronics (KSE: 005930), Silvaco, STMicroelectronics (NYSE: STM), Synopsys (NASDAQ: SNPS), and Tanner EDA.

Si2 is the largest organization of industry-leading semiconductor, systems, EDA and manufacturing companies focused on the development and adoption of standards to improve the way integrated circuits are designed and manufactured. Now in its 26th year, Si2 is uniquely positioned to enable timely collaboration through dedicated staff and a strong implementation focus driven by its member companies. Si2 represents over 100 companies involved in all parts of the silicon supply chain throughout the world. http://www.si2.org/si2_home.php



Contact:

Silicon Integration Initiative
William Bayer, 512-342-2244, ext. 304




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