Cadence Announces New Integrated Solution for Rapid Die-Package Interconnect Planning

Enables concurrent optimization of multi-fabric elements, leading to lower cost and higher performance

SAN JOSE, Calif., May 21, 2014 — (PRNewswire) —  Cadence Design Systems, Inc., a leader in global electronic design innovation, today announced a new integrated solution to significantly cut down die-package interconnect planning time from weeks to days by reducing iterations between silicon and package design teams. The solution, built on Cadence® OrbitIO™ technology, also shortens the time to converge on the physical interface between the die and package up to 60 percent, all within the context of the full system.

Cadence Logo.

Building on its leadership position for co-design in the implementation stage, Cadence OrbitIO technology is used earlier in the design cycle to provide rapid interconnect planning of high-performance interfaces across multiple fabrics. As part of an overall co-design solution, Cadence OrbitIO technology provides seamless integration with Cadence SiP Layout and the Cadence Encounter® digital implementation platform. This integrated solution allows design teams to clearly communicate design intent throughout the flow, resulting in better decision-making, fewer iterations and shorter cycle-times. It can enable fabless semiconductor or systems companies to evaluate package route feasibility, and allows them to communicate a route plan to their package design resources, whether it is to an internal group or to an outsourced assembly and test (OSAT) provider.

"The Cadence OrbitIO global view of system connectivity helps Faraday reduce the time required to converge on the optimal die bump to package ball pad assignment," said Dr. Wang-Jin Chen, senior technologist of Faraday. "The combination of connectivity optimization and route feasibility functions helped us produce a route plan resulting in two fewer package layers with all DDR signals implemented on a single package layer."

To learn more about OrbitIO technology, please visit: www.cadence.com/products/sigrity/orbitio/pages/default.aspx

About Cadence

Cadence  (NASDAQ: CDNS) enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software, hardware, IP, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available here.

© 2014 Cadence Design Systems, Inc. All rights reserved worldwide. Cadence, the Cadence logo, and Encounter are registered trademarks of, and OrbitIO is a trademark of, Cadence Design Systems, Inc. in the United States and other countries.

For more information, please contact:
Cadence Newsroom
408-944-7039
Email Contact

Logo - http://photos.prnewswire.com/prnh/20140102/SF39436LOGO

 

SOURCE Cadence Design Systems, Inc.

Contact:
Cadence Design Systems, Inc.
Web: http://www.cadence.com




Review Article Be the first to review this article
Autodesk - DelCAM

Featured Video
Editorial
Jeff RoweJeff's MCAD Blogging
by Jeff Rowe
Hexagon’s Recent Ups & Downs Update
Jobs
Solidworks Product Designer for NASCENT Technology at Charlotte, NC
Developer-Support-Implementation Engineer for EDA Careers at San Francisco Area, CA
SYSTEMS INTEGRATOR for Palm Beach County Human Resources at West Palm Beach, FL
CAD/CAM Regional Account Manager (Pacific Northwest) for Vero Software Inc. at Seattle, WA
Upcoming Events
AI·GI·CRV Conference 2017 at Edmonton, Alberta Canada - May 16 - 19, 2017
Innorobo 2017 at Docks de Paris Paris France - May 16 - 18, 2017
Display Week 2017 at Los Angeles Convention Center 1201 S Figueroa St Los Angeles CA - May 21 - 26, 2017
LiveWorx Tech Conf 2017 at Boston MA - May 22 - 25, 2017



Internet Business Systems © 2017 Internet Business Systems, Inc.
595 Millich Dr., Suite 216, Campbell, CA 95008
+1 (408)-337-6870 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation GISCafe - Geographical Information Services TechJobsCafe - Technical Jobs and Resumes ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy Policy Advertise