Ziptronix ZiBond® Technology Proven for Consumer Mobile Market

Ziptronix Licenses ZiBondto IO Semiconductor for RF Applications

RESEARCH TRIANGLE PARK, N.C., April 29, 2014 -- ­ Ziptronix Inc., a provider of patented, low-temperature direct bonding technology for 3D integration, today announced a limited exclusive patent licensing agreement with IO Semiconductor (IOsemi) for application of its ZiBondtechnology for use in RF front-end devices for consumer mobile products. The agreement also marks a new high-volume application market for Ziptronix's proprietary ZiBond technology.

"This license agreement with IOsemi is an exciting win for us because it extends our reach into rapidly growing mobile markets by opening up a new high-volume application space for us," noted Dan Donabedian, CEO and president of Ziptronix. "It also demonstrates the value of licensing established technologies like ZiBond, which in this case enables IOsemi to deliver innovative RF front-end solutions with improved performance and lower cost."

IOsemi's ZEROcap CMOS technology is based on a mature 0.18µm CMOS process. It provides best-in-class RF performance with lower insertion loss and better linearity than other available technologies. This performance is achieved while delivering smaller footprints and lower cost than competitive devices. Implementing ZiBond further enables the low-cost manufacture of RF switches using standard CMOS processes. Because the bond itself is as strong as or stronger than the bulk material, it stands up better to post-bond processes than other bonding technologies.

"Licensing ZiBond for use in RF front-end applications adds a highly manufacturable, high-volume bond to our technology arsenal," said Mark Drucker, CEO of IO Semiconductor. "It provides a key enabling technology that has allowed IOsemi to deliver better-performing, lower-cost RF solutions than our competitors. We have implemented this process with a top-tier manufacturing partner and have achieved world-class yields and reliability."

Ziptronix's proprietary ZiBond process allows for the formation of low-temperature, direct, nonadhesive wafer-to-wafer and die-to-wafer bonds in a wide variety of semiconductor materials by using a very thin layer of materials such as silicon oxide or nitride to facilitate direct bonding. Already established in volume production for back-side illumination (BSI) image sensors, the license agreement with IOsemi takes ZiBond into high-volume manufacturing for RF front-end devices as well, further proving its value to the consumer mobile market.

About Ziptronix

A pioneer in the development of low-temperature direct bond technology, Ziptronix offers patented technology for wafer- or die-level bonding. Its ZiBond® Direct Bonding and DBI® Hybrid Bonding technologies deliver the industry's most scalable, manufacturable and lowest total cost-of-ownership solutions for 3D stacking. The company's intellectual property has been licensed for a variety of semiconductor applications including BSI sensors, RF front ends, pico-projectors, memories and 3D integrated circuits. Founded in 2000 as a venture-backed spinoff of RTI International, the company has been issued more than 40 U.S. patents and more than 35 international patents, with more than 50 U.S. and international patent applications pending. www.ziptronix.com.

About IO Semiconductor

IO Semiconductor (IOsemi) was incorporated in 2008 by a team of semiconductor veterans with deep and broad experience in semiconductor processing and RF chip design. In November 2012, IO Semiconductor was acquired by The Silanna Group Pty Ltd., with headquarters in Brisbane, Australia. IOsemi is rapidly establishing a leadership position in the RF switch market based on its proprietary ZEROcap CMOS technology. www.iosemi.com.


Contact:

Chris Sanders
Director,
Business Development
Ziptronix
919-459-2444
Email Contact

Lew Boore
Vice President,
Worldwide Sales
858-373-0452
Email Contact
   
                                                          

Amy Smith
Impress Labs
401-369-9266
Email Contact




Review Article Be the first to review this article

Featured Video
Jobs
Senior Account Manager, Utilities for RAMTeCH Software Solutions, Inc. at Stillwater, Minnesota
GIS ANALYST for Cobb County Government at Marietta, California
BIM / REVIT Senior Structural Modeler for McNamara Salvia at New York, California
GIS Analyst for Institute for Children and Poverty at New York, California
Business Development Leader for Geomni, Inc at Spartanburg, South Carolina
Upcoming Events
COMSOL Conference 2018 Lausanne at SwissTech Convention Center Quartier Nord EPFL, Route Louis-Favre 2, 1024 Ecublens Switzerland - Oct 22 - 24, 2018
6th OpenFOAM Conference 2018 at Radisson Blu Hotel, Hamburg Airport Flughafenstraße 1-3 Hamburg Germany - Oct 23 - 25, 2018
ASSESS 2018 CONGRESS at Chateau Elan Winery & Resort 100 Rue Charlemagne, Braselton GA - Oct 28 - 30, 2018
MEMS & Sensors Executive Congress—MSEC 2018 at Silverado Resort and Spa 1600 Atlas Peak Road Napa CA - Oct 28 - 30, 2018
Kenesto: 30 day trial



Internet Business Systems © 2018 Internet Business Systems, Inc.
25 North 14th Steet, Suite 710, San Jose, CA 95112
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation GISCafe - Geographical Information Services TechJobsCafe - Technical Jobs and Resumes ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise