CEVA-TeakLite-4 multifunctional capabilities now support widest range of applications on a single core, including Bluetooth connectivity, audio, voice and sensingSANTA CLARA, Calif., April 30, 2014 — (PRNewswire) — Linley Mobile Conference -- CEVA, Inc. (NASDAQ: CEVA), the leading licensor of silicon intellectual property (SIP) platform solutions and DSP cores today announced that the CEVA-TeakLite-4 DSP is now handling the processing load of Bluetooth, in addition to audio, voice and sensing technologies, thereby dramatically lowering the cost, complexity and power consumption of chip designs targeting smartphones, the Internet of Things (IoT), wearables and wireless audio devices. Leveraging new instructions and interfaces added to the recently introduced multifunctional CEVA-TeakLite-4 v2 architecture, the DSP now runs CEVA-Bluetooth connectivity (Classic or Low Energy) in addition to a broad range of audio and voice software packages, 'always-on' user interface (UI) functions such as voice triggering and face activation, and a full suite of sensor-fusion capabilities, all on a single core. CEVA is presenting this multifunctional DSP today at the Linley Mobile Conference, in Santa Clara, California.
The Internet of Things comprises a multitude of devices, technologies and form factors, with many use cases and requirements. The CEVA-TeakLite-4 specifically targets user-centric IoT devices, where natural user interface, audio playback and voice communication represent key attributes of the device. This can include for example, voice activation, face triggering and other 'always-on' functionality in a smartphone, smart watch, smart home controller or wireless speakers. The ultra-low power nature of the CEVA-TeakLite-4 DSP ensures that these 'always-on' features consume minimal battery life. All of this functionality can run concurrently on the DSP without the need for a host CPU, reducing the die size and lowering power consumption of the overall device. Illustrating this, a real-life use case implementing Bluetooth Low Energy, always-on UI and sensor fusion on the CEVA-TeakLite-4 DSP requires less than 150K gates and consumes less than 150uW when implemented in a 28nm process.
Eran Briman, vice president of marketing at CEVA, commented: "Our industry leadership and broad product offering of low power DSPs, software technologies and Bluetooth IP allows our customers to meet all of the market requirements for connectivity, audio, voice and sensor-fusion from a single vendor, all optimized for the lowest power use cases. No other player in the IP industry today can offer such a complete and robust portfolio of IPs targeting this space. We will continue to broaden the technologies supported by the CEVA-TeakLite-4 to address the growing range of use cases where DSP cores are critical to the performance and battery life of these devices."
The CEVA-TeakLite-4 is now capable of supporting the following on a single core:
- Bluetooth 4.1 (Classic and Low Energy)
- Always-on functionality e.g. voice trigger, face detection
- HD audio playback and post-processing
- Voice communication and noise-reduction
- Sensor fusion (context awareness)
- Android Multimedia Framework (AMF), supporting the offload of various processing elements from the CPU onto the DSP under an Android OS (including KitKat)
In addition, CEVA-TeakLite-4 also offers customers ample headroom to add functionality such as GNSS navigation and Wi-Fi connectivity, or add proprietary / 3rd party software to further differentiate their solution. More information is available on the CEVA website at www.ceva-dsp.com/CEVA-TeakLite-4.
About CEVA, Inc.
CEVA is the world's leading licensor of silicon intellectual property (SIP) DSP cores and platform solutions for the mobile, digital home and networking markets. CEVA's IP portfolio includes comprehensive technologies for cellular baseband (2G / 3G / 4G), multimedia (vision, imaging and HD audio), voice processing, Bluetooth, Serial Attached SCSI (SAS) and Serial ATA (SATA). In 2013, CEVA's IP was shipped in more than one billion devices, including 40% of handsets shipped worldwide, powering smartphones from many of the world's leading OEMs such as HTC, Huawei, Lenovo, LG, Nokia, Motorola, Samsung, Sony, TCL and ZTE. For more information, visit www.ceva-dsp.com. Follow CEVA on twitter at www.twitter.com/cevadsp.
SOURCE CEVA, Inc.
Richard Kingston, CEVA, Inc.
Mike Sottak, Wired Island, Ltd.