Vicor has also introduced new digital telemetry and control capabilities for its ChiP BCM portfolio, available as an option for the new 1.75 kW modules and previously announced 1.2 kW modules. This PMBus compliant digital interface option gives system designers access to the ChiP BCM's internal controller, enabling digital communication with an array of ChiP BCMs via a single bus for control, configuration, monitoring and other telemetry functions.
Vicor's ChiP BCMs' power performance profile is made possible by the underlying ZCS/ZVS Sine Amplitude Converter topology. Operating at megahertz switching frequency, ChiP BCMs enable fast response time and low noise operation at industry leading efficiencies. High fixed frequency operation also simplifies and reduces the size of external filter designs, yielding additional cost savings and accelerating time to market.
The new ETSI and ITU compliant 1.75 kW modules support a nominal input voltage of 400 V and nominal output voltage of 50 V, with a K-factor of 1/8. Vicor's 1.2 kW and new 1.75 kW BCMs are offered in the 6123 package. Standard BCM features include bidirectional operation, under-over-voltage lockout, over-current, short circuit and over-temperature protection.
"With the introduction of our newest ChiP BCMs, we've again raised the bar for bus converter power density while introducing new digital communication functionality for customers seeking flexible control and monitoring capabilities," said Stephen Oliver, VP of VI Chip product line, Vicor. "These features extend the value and versatility of the ChiP BCM product family, enabling power engineers to achieve new levels of system power performance for high voltage DC distribution in datacenter, telecom and industrial applications."
Converter housed in Package (ChiP) Platform
Vicor's ChiP platform sets best-in-class standards for a new generation of scalable power modules. Leveraging advanced magnetic structures integrated within high density interconnect (HDI) substrates with power semiconductors and control ASICs, ChiP-based power modules provide superior thermal management supporting unprecedented power density. Thermally adept ChiP-based modules enable customers to achieve low cost power systems with previously unattainable system size, weight and efficiency attributes, quickly and predictably. The ChiP platform embodies a modular power system design methodology that enables designers to achieve high-performance, cost-effective power systems from AC or DC sources to the Point of Load using proven building blocks.
Pricing and Availability
Vicor's 1.75 kW ChiP BCMs and 1.2 kW ChiP BCMs are available today -- pricing for OEM quantities is $170.00 and $120.00 respectively. The digital telemetry and control options are priced separately. Visit the website for more information. To order, email email@example.com or call 1-800-735-6200.
About Vicor Corporation
Headquartered in Andover, Massachusetts, Vicor Corporation designs, manufactures and markets innovative, high-performance modular power components, from bricks to semiconductor-centric solutions, to enable customers to efficiently convert and manage power from the wall plug to the point of load. Complementing an extensive portfolio of patented innovations in power conversion and power distribution with significant application development expertise, Vicor offers comprehensive product lines addressing a broad range of power conversion and management requirements across all power distribution architectures, including CPA, DPA, IBA, FPA and CBA. Vicor focuses on solutions for performance-critical applications in the following markets: enterprise and high performance computing, telecommunications and network infrastructure, industrial equipment and automation, vehicles and transportation and aerospace and defense electronics. www.vicorpower.com
Vicor, BCM, Sine Amplitude Converter, VI Chip and FPA are trademarks of Vicor Corporation. The PMBus name and logo are trademarks of SMIF, Inc.
Contact: Colin Boroski Rainier Communications 508-475-0025 x 142 Email Contact