Metrology, Inspection, and Process Control in VLSI Manufacturing

DUBLIN, April 11, 2014 — (PRNewswire) —

Dublin - Research and Markets ( http://www.researchandmarkets.com/research/gr7z43/metrology) has announced the addition of the "Metrology, Inspection, and Process Control in VLSI Manufacturing" report to their offering.

     (Logo: http://photos.prnewswire.com/prnh/20130307/600769 )


The increase in complexity of semiconductors and the resulting increase in the complexity and cost of the semiconductor manufacturing process has been a driver of demand for metrology systems.

This report offers a complete analysis of the Process Control market, segmented as: Lithography Metrology; Wafer Inspection/Defect Review; Thin Film Metrology; and Other Process Control Systems. Each of these sectors is further segmented.

Market shares of competitors for all segment is presented.


Key Topics Covered:

Chapter 1 Introduction

Chapter 2 Executive Summary

Chapter 3 Metrology/Inspection Technologies
3.1 Introduction
3.2 Imaging Techniques
3.2.1 Scanning Electron Microscope (SEM)
3.2.2 Transmission Electron Microscope (TEM)
3.3 Scanning Probe Microscopes
3.3.1 Atomic Force Microscopy (AFM)
3.3.2 Scanning Tunneling Microscopy (STM)
3.3.3 Scanning Probe Microscopy (SPM)
3.3.4 AFM Types
3.3.4.1 Contact AFM
3.3.4.2 Dynamic Force Mode AFM Techniques
3.3.5 Scanning Surface Potential Microscopy (SSPM)
3.4 Optical Techniques
3.4.1 Scatterometry
3.4.1.1 Ellipsometry
3.4.1.2 Reflectometry
3.4.1.3 Scatterometry Developments
3.4.2 Total Reflection X-Ray Fluorescence (TXRF)
3.4.3 Energy Dispersive X-Ray Analysis (EDX)
3.4.4 Secondary Ion Mass Spectrometry (SIMS)
3.4.4.1 Surface Imaging Using SIMS
3.4.4.2 SIMS Depth Profiling
3.4.5 Auger Electron Spectroscopy
3.4.6 Focused Ion Beam (FIB)
3.4.7 X-Ray Reflectometry (XRR)
3.4.8 X-Ray Photoelectron Spectroscopy (XPS)
3.4.9 Rutherford Backscattering (RBS)
3.4.10 Optical Acoustics Metrology
3.4.11 Fourier Transform Infrared Spectroscopy (FTIR)
3.4.12 Thermally-Induced Voltage Alteration (TIVA)
3.5 Film Thickness And Roughness
3.5.1 Surface Inspection Technology
3.5.2 Dimensional Technology
3.5.3 Stylus Profilometer

Chapter 4 Defect Review/Wafer Inspection
4.1 Introduction
4.2 Defect Review
4.2.1 SEM Defect Review
4.2.2 Optical Defect Review
4.2.3 Other Defect Review
4.3 Patterned Wafer Inspection
4.3.1 E-Beam Patterned Wafer Inspection
4.3.2 Optical Patterned Wafer Inspection
4.4 Unpatterned Wafer Inspection
4.5 Macro-Defect Inspection

Chapter 5 Thin Film Metrology
5.1 Introduction
5.1.1 Front End Applications
5.1.2 Back End Applications
5.2 Metal Thin-Film Metrology
5.3 Non-Metal Thin-Film Metrology
5.4 Substrate/Other Thin Film Metrology

Chapter 6 Lithography Metrology
6.1 Overlay
6.2 CD
6.3 Mask (Reticle) Metrology/Inspection

Chapter 7 Market Forecast
7.1 Introduction
7.2 Market Forecast Assumptions
7.3 Market Forecast

Chapter 8 Integrated/In-Situ Metrology/Inspection Trends
8.1 Introduction
8.2 In-Situ Metrology
8.3 Integrated Metrology
8.3.1 Benefits
8.3.2 Limitations

Chapter 9 Key Drivers
9.1 300mm/450mm Wafers
9.2 Copper Metrology
9.3 Low-K Dielectrics
9.4 Chemical Mechanical Planarization (CMP)
9.5 Ion Implant

For more information visit http://www.researchandmarkets.com/research/gr7z43/metrology


Media Contact: Laura Wood , +353-1-481-1716, Email Contact

SOURCE Research and Markets

Contact:
Research and Markets




Review Article Be the first to review this article
Rand3D

Editorial
Jeff RoweJeff's MCAD Blogging
by Jeff Rowe
First Look At SOLIDWORKS 2018
Jobs
Architectural Designer for Champion Home Builders at Troy, MI
Analyst Programmer for Palm Beach County at West Palm Beach, FL
Mapping & GIS Sales Rep for California Surveying & Drafting Supply at Sacramento, CA
Upcoming Events
ATE SOLIDWORKS Innovation Day 2017 at LIFELONG LEARNING INSTITUTE LEVEL 2 @ 11 EUNOS ROAD 8 SINGAPORE Singapore - Oct 5, 2017
Additive Manufacturing Conference 2017 at Knoxville Convention Center 701 Henley Street Knoxville TN - Oct 10 - 12, 2017
ASSESS 2017 CONGRESS at Bolger Center Potomac MD - Nov 1 - 3, 2017
FABTECH 2017 at McCormick Place Chicago IL - Nov 6 - 9, 2017
MasterCAM



Internet Business Systems © 2017 Internet Business Systems, Inc.
25 North 14th Steet, Suite 710, San Jose, CA 95112
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation GISCafe - Geographical Information Services TechJobsCafe - Technical Jobs and Resumes ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise