Toshiba Launches Photorelays in Industry's Smallest Package

TOKYO — (BUSINESS WIRE) — January 31, 2014Toshiba Corporation (TOKYO:6502) today announced the launch of photorelays in the industry’s smallest[1] package. Shipment of mass production products starts from today.

Toshiba: VSON (Very Small Outline Non-leaded) Package Photorelays (Photo: Business Wire)

Toshiba: VSON (Very Small Outline Non-leaded) Package Photorelays (Photo: Business Wire)

The new products, “TLP3403” and “TLP3412”, utilize the industry’s smallest package for photocouplers, the Toshiba-developed VSON (Very Small Outline Non-leaded) package. Compared to equivalent Toshiba products in a USOP package, the new photorelays reduce the assembly area by 50% and volume by 60%. This can contribute to the development of smaller and thinner sets and also makes it possible to increase the number of photorelays on a circuit board to 1.3 times to 1.5 times that of conventional products.

Also, by using a new internal structure, a chip-on-chip structure[2], the new products, while retaining the same electrical characteristics as conventional USOP package products, secure improved high-frequency characteristics, which are necessary for signal transmission. The new photocouplers are suitable for various tester applications, especially for use in power-line switching and measuring-line switching.

   

Key Specifications of New Products

         
Part Number TLP3403 TLP3412
Package Dimension Area: 1.5 mm × 2.5 mm (max)

Height: 1.3 mm (max)

On-state Current 1 A (max) 0.4 A (max)
On-state Resistance 0.18 Ω (typ), 0.22 Ω (max) 1 Ω (typ), 1.5 Ω (max)
Off-state Voltage 20 V (min) 60 V (min)
Off-state Capacitance

(Photo side)

40 pF (typ) 20 pF (typ)
Trigger LED Current 3 mA (max)
Equivalent Rise Time

(Pass Characteristic)

40 ps (typ)
Isolation Voltage   300 Vrms(min)
 

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