Toshiba Launches Photorelays in Industry's Smallest Package

TOKYO — (BUSINESS WIRE) — January 31, 2014Toshiba Corporation (TOKYO:6502) today announced the launch of photorelays in the industry’s smallest[1] package. Shipment of mass production products starts from today.

Toshiba: VSON (Very Small Outline Non-leaded) Package Photorelays (Photo: Business Wire)

Toshiba: VSON (Very Small Outline Non-leaded) Package Photorelays (Photo: Business Wire)

The new products, “TLP3403” and “TLP3412”, utilize the industry’s smallest package for photocouplers, the Toshiba-developed VSON (Very Small Outline Non-leaded) package. Compared to equivalent Toshiba products in a USOP package, the new photorelays reduce the assembly area by 50% and volume by 60%. This can contribute to the development of smaller and thinner sets and also makes it possible to increase the number of photorelays on a circuit board to 1.3 times to 1.5 times that of conventional products.

Also, by using a new internal structure, a chip-on-chip structure[2], the new products, while retaining the same electrical characteristics as conventional USOP package products, secure improved high-frequency characteristics, which are necessary for signal transmission. The new photocouplers are suitable for various tester applications, especially for use in power-line switching and measuring-line switching.

   

Key Specifications of New Products

         
Part Number TLP3403 TLP3412
Package Dimension Area: 1.5 mm × 2.5 mm (max)

Height: 1.3 mm (max)

On-state Current 1 A (max) 0.4 A (max)
On-state Resistance 0.18 Ω (typ), 0.22 Ω (max) 1 Ω (typ), 1.5 Ω (max)
Off-state Voltage 20 V (min) 60 V (min)
Off-state Capacitance

(Photo side)

40 pF (typ) 20 pF (typ)
Trigger LED Current 3 mA (max)
Equivalent Rise Time

(Pass Characteristic)

40 ps (typ)
Isolation Voltage   300 Vrms(min)
 

1 | 2  Next Page »



Review Article Be the first to review this article
Rand3D

SolidCAM - Break The Chains

Featured Video
Jobs
Mechanical Engineer for Allen & Shariff Corporation at Pittsburgh, Pennsylvania
Mid-Level Mechanical Engineer for Kiewit at lenexa, Kansas
System Designer/Engineer for Bluewater at Southfield, Michigan
GIS Data Analyst for CostQuest Associates, Inc. at Cincinnati, Ohio
Software Developer for CHA Consulting, Inc. at Norwell, Massachusetts
Product Manager for CHA Consulting, Inc. at Boston, Massachusetts
Upcoming Events
Live SOLIDWORKS Event Hosted by Converge at 2482 Patterson Rd Unit 2 Grand Junction CO - May 22, 2018
ESPRIT World 2018 at Indianapolis Marriott Downtown 350 West Maryland Street Indianapolis IN - Jun 11 - 15, 2018
HxGN LIVE 2018 at The Venetian Las Vegas NV - Jun 12 - 15, 2018
IMTS2018 International Manufacturing Tech Show at McCormick Place Chicago IL - Sep 10 - 15, 2018
Kenesto: 30 day trial
MasterCAM



Internet Business Systems © 2018 Internet Business Systems, Inc.
25 North 14th Steet, Suite 710, San Jose, CA 95112
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation GISCafe - Geographical Information Services TechJobsCafe - Technical Jobs and Resumes ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise