Toshiba TK31E60W 4thgen DTMOS 600V Super-Junction MOSFET Reverse Costing Analysis

DUBLIN, November 20, 2013 — (PRNewswire) —

Research and Markets ( http://www.researchandmarkets.com/research/8dxmlg/toshiba_tk31e60w) have announced the addition of the "Toshiba TK31E60W 4thgen DTMOS 600V Super-Junction MOSFET Reverse Costing analysis" report to their offering.

     (Logo: http://photos.prnewswire.com/prnh/20130307/600769 )

The first Deep Trench Super-Junction MOSFET from Toshiba manufactured with a deep trench filling process 30% more efficient that the previous generation

The new generation Superjunction MOSFET from Toshiba has several new features.

First, the superjunction is not manufactured with a standard multi-epitaxy process but using a new deep trench filling process. This technique allows to narrow the pitch and results in a Rds(on) 30% lower. Moreover, the process simplification reduces the manufacturing cost by more than 20%.

Second, a trench gate replaces the traditional gate. The trench gate allows a greater reduction in the pitch and the Rds(on).

The DTMOS-4 MOSFET are targeted for power switching applications and offer a better power efficiency.

This report provides a reverse costing analysis of this power transistor with:

- Detailed photos & material analysis
- Manufacturing Process Flow
- In-depth economical analysis
- Manufacturing cost breakdown
- Selling price estimation

Key Topics Covered:

Executive Summary
Table of Contents
Reverse Costing Methodology

1. Physical Analysis
Physical Analysis Methodology
Package
Die Overview
Gate
Guard Ring
MOSFET Cell Super-Junction
MOSFET Cell
Polysilicon Gate Contact
Guard Ring
Back Side
MOSFET Structure
Deep Trench Super-Junction

2. Manufacturing Process
DTMOS Transistor Process Flow
Process Flow

3. Manufacturing Cost
Wafer Fabrication Unit
Yields Explanation
MOSFET Unprobed Wafer Cost
Wafer Cost per Process Steps
Equipment Cost per Family
Material Cost per Family
Probe Test
Dicing and Package
Final Test Cost
Component Manufacturing Cost
Yields Synthesis

4. Price Estimation
Contacts
Glossary

For more information visit  http://www.researchandmarkets.com/research/8dxmlg/toshiba_tk31e60w

Research and Markets
Laura Wood, Senior Manager.
Email Contact
U.S. Fax: 646-607-1907
Fax (outside U.S.): +353-1-481-1716
Sector: Advanced Technology

SOURCE Research and Markets

Contact:
Research and Markets




Review Article Be the first to review this article

Autodesk University 2017

Featured Video
MCAD Corporate Newsletter
rss feed
Editorial
Jeff RoweJeff's MCAD Blogging
by Jeff Rowe
NVIDIA’s AI Computer Drives AVs
Jobs
Senior Mechanical Engineer for Albert Kahn and Associates at Detroit, MI
Mechanical Engineer for The Planate Management Group LLC at Perry Point, MD
Structural Engineer for Albert Kahn and Associates at Detroit, MI
ENVIRONMENTAL GRAPHIC DESIGNER for Blitz at San Francisco, CA
Structural Engineer for The Planate Management Group LLC at Perry Point, MD
Upcoming Events
ASSESS 2017 CONGRESS at Bolger Center Potomac MD - Nov 1 - 3, 2017
FABTECH 2017 at McCormick Place Chicago IL - Nov 6 - 9, 2017
ATX MINNEAPOLIS 2017 at Minneapolis MN - Nov 8 - 9, 2017
2017 China Chongqing International Machine Tool Show (CCIMT) at Chongqing International Expo Center, Yubei Chongqing China - Nov 13 - 16, 2017



Internet Business Systems © 2017 Internet Business Systems, Inc.
25 North 14th Steet, Suite 710, San Jose, CA 95112
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation GISCafe - Geographical Information Services TechJobsCafe - Technical Jobs and Resumes ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise