Giga Scale IC's Vin Ratford to Moderate Panel on Semiconductor Intellectual Property During Semiconductor Venture Fair III

FSA-Hosted Event Will Identify Challenges, Opportunities of Growing Segment

CUPERTINO, Calif.—(BUSINESS WIRE)—May 10, 2004— Vin Ratford, president of Giga Scale Integration Corporation (Giga Scale IC(TM)), will moderate a panel titled, "Challenges and Opportunities in Semiconductor intellectual property (IP)," during Semiconductor Venture Fair III. The session, hosted by the Fabless Semiconductor Association (FSA) IP Committee, will be held Wednesday, May 12, from 8:15-9:45 a.m. at the Wyndham San Jose Hotel on North First Street in San Jose, Calif.

The panel of semiconductor industry experts will examine the IP business that has grown throughout the recent downturn to almost $1 billion in yearly sales. Panelists will discuss whether this growth can be sustained and winners and losers going forward. They will attempt to answer whether IP quality will improve to allow for more outsourcing, what business models are likely to succeed, and how to respond to technical and economic challenges of 90 nm design.

Panelists are: Liam Goudge, director of worldwide business development at ARM Ltd.; Mark Templeton, president and chief executive officer (CEO) of Artisan Components; Aurangzeb Khan, corporate vice president of business development and chief technology officer of worldwide field operations at Cadence Design Systems; Lucio Lanza, managing partner of Lanza Tech Ventures; Rich Wawrzyniak, senior analyst application specific integrated circuit (ASIC) and system on chip (SoC) at Semico Research Corp.; and Kurt Wolf, director of the Library Management Division of TSMC.

Semiconductor Venture Fair III will take place May 11-12. It brings together private equity investors, executives of leading semiconductor companies, and entrepreneurs from emerging semiconductor-related companies to explore significant investment opportunities in today's semiconductor sector. More details can be found at: http://www.semiconductorventurefair.com.

About Giga Scale IC

Founded in 2003, Giga Scale Integration Corporation -- or Giga Scale IC(TM) -- is a private Electronic Design Automation (EDA) software company that develops InCyte(R), the first Specification Optimization System for integrated circuit (IC) design. Used during the Specify and Create phases of design, InCyte generates a Silicon Virtual Model(TM) (SVM) containing power, leakage, speed, die size, yield and cost for different processes. InCyte includes a specification cockpit, floorplanner and estimator bundled with semiconductor intellectual property (IP) to create the SVM. The SVM interfaces with other EDA tools and is used across the semiconductor supply chain to ensure compliance with the specification. Giga Scale IC corporate headquarters are located at: 10050 North Wolfe Road, Suite SW1-266, Cupertino, Calif. 95014. Telephone: (408) 255-0444. Facsimile: (408) 255-0344. Email: info@gigaic.com. Web Site: http://www.gigaic.com.

InCyte, InCyte-Specify, InCyte-Create and Time Architect are registered trademarks of Giga Scale Integration Corporation. Giga Scale IC, First Tool in the Design Chain and Silicon Virtual Model are trademarks of Giga Scale Integration Corporation. Giga Scale IC acknowledges trademarks or registered trademarks of other organizations for their respective products and services.



Contact:
Public Relations for Giga Scale IC
Nanette Collins, 617-437-1822

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